Browsing by Author "Han, Bing"

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    Data on single pulse fs laser induced submicron bubbles in the subsurface region of soda-lime glass
    (Amsterdam [u.a.] : Elsevier, 2020) Lai, Shengying; Ehrhardt, Martin; Lorenz, Pierre; Lu, Jian; Han, Bing; Zimmer, Klaus
    Submicron bubble formation in the subsurface range of soda-lime glass is investigated. The bubbles are induced by single femtosecond laser pulse irradiation with the wavelength of λ = 775 nm, the pulse duration of tp = 150 fs and the laser beam diameter of ∼12 μm. The data shows the changes of the morphologies of the soda-lime glass after laser irradiation with different pulse energy. Moreover, the data shows the detail of the cross-section view of the bubble during the Focused ion beam (FIB) cutting. It is found that the bubbles can be formed in a rather narrow pulse energy range with the bubbles in the size of 300 nm ∼3 μm which is much smaller than the laser beam diameter. Data presented in this article are related to the research article “Submicron bubbles/voids formation in the subsurface region of soda-lime glass by single pulse fs laser-induced spallation” [1]. © 2020
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    Laser-induced reactive microplasma for etching of fused silica
    (Berlin ; Heidelberg ; New York : Springer, 2020) Ehrhardt, Martin; Lorenz, Pierre; Han, Bing; Zimmer, Klaus
    The ultra-precise machining (UPM) of surfaces with contact-free, beam-based technologies enables the development of flexible and reliable fabrication methods by non-vacuum processes for future application in advanced industrial fields. Laser machining by laser ablation features limitations for ultra-precise machining due to the depth precision, the surface morphology, and laser-induced defect formation. Contrary to physically-based etching, chemical-based dry and wet processing offer high quality, low damage material removal. In order to take advantage of both principles, a combined laser-plasma process is introduced. Ultra-short laser pulses are used to induce a free-standing microplasma in a CF4 gas atmosphere due to an optical breakdown. CF4 gas, with a pressure of 800–900 mbar, is ionized only near the focal point and reactive species are generated therein. Reactive species of the laser-induced microplasma can interact with the surface atoms of the target material forming volatile products. The release of these products is enhanced by the pulsed, laser-induced plasma resulting in material etching. In the present study, SiO2 surfaces were etched with reactive species of CF4 microplasma generated by their laser-induced break down with 775 nm pulses of an fs-laser (150 fs) at a repetition rate of 1 kHz. The dependency of the depth, the width, and the morphology of the etching pits were analysed systematically against the process parameters used. In particular, a linear increase of the etching depth up to 10 µm was achieved. The etched surface appears smooth without visible cracks, defects, or LIPSS (Laser-induced periodic surface structures). © 2020, The Author(s).