CC BY 4.0 UnportedGehring, H.Blaicher, M.Hartmann, W.Varytis, P.Busch, K.Wegener, M.Pernice, W.H.P.2021-10-212021-10-212019https://oa.tib.eu/renate/handle/123456789/7076https://doi.org/10.34657/6123Providing efficient access from optical fibers to on-chip photonic systems is a key challenge for integrated optics. In general, current solutions allow either narrowband out-of-plane-coupling to a large number of devices or broadband edge-coupling to a limited number of devices. Here we present a hybrid approach using 3D direct laser writing, merging the advantages of both concepts and enabling broadband and low-loss coupling to waveguide devices from the top. In the telecom wavelength regime, we demonstrate a coupling loss of less than -1.8 dB between 1480 nm and 1620 nm. In the wavelength range between 730 nm and 1700 nm, we achieve coupling efficiency well above -8 dB which is sufficient for a range of broadband applications spanning more than an octave. The 3D couplers allow relaxed mechanical alignment with respect to optical fibers, with -1 dB alignment tolerance of about 5 μm in x- and y-directions and -1 dB alignment tolerance in the z-direction of 34 μm. Using automatized alignment, many such couplers can be connected to integrated photonic circuits for rapid prototyping and hybrid integration. © 2019 Author(s).enghttps://creativecommons.org/licenses/by/4.0/530Fits and tolerancesOptical fibersAlignment toleranceBroadband applicationsCoupling efficiencyDirect laser writingHybrid integrationIntegrated photonic circuitMechanical alignmentTelecom wavelengthsAlignmentArticle