Search Results
Contact Aging Enhances Adhesion of Micropatterned Silicone Adhesives to Glass Substrates
2020, Thiemecke, Jonathan, Hensel, René
The transfer of biological concepts into synthetic micropatterned adhesives has recently enabled a new generation of switchable, reversible handling devices. Over the last two decades, many design principles have been explored that helped to understand the underlying mechanics and to optimize such adhesives for certain applications. An aspect that has been overlooked so far is the influence of longer hold times on the adhesive contacts. Exemplarily, the pull‐off stress and work of separation of a micropatterned adhesive specimen are enhanced by factors 3 and 6, respectively, after 1000 min in contact with a glass substrate. In addition to such global measures, the increase of adhesion of all individual micropillars is analyzed. It is found that contact aging varied across the microarray, as it drastically depends on local conditions. Despite great differences on the micropillar scale, the adhesion of entire specimens increased with very similar power laws, as this is determined by the mean contact ageing of the individual structures. Overall, contact aging must be critically evaluated before using micropatterned adhesives, especially for long‐term fixations and material combinations that are chemically attractive to each other.
Elastohydrodynamic Dewetting of Thin Liquid Films: Elucidating Underwater Adhesion of Topographically Patterned Surfaces
2020, Chudak, Maciej, Chopra, Vaishali, Hensel, René, Darhuber, Anton A.
In underwater adhesion of a topographically patterned surface with a very soft material such as human skin, the elastic deformation can be large enough to achieve solid-on-solid contact not only on top of the hills but also in the valleys of the substrate topography. In this context, we have studied the dynamics of dewetting of a thin liquid film confined between a rigid, periodic micropillar array and a soft, elastic sphere. In our experiments, we observed two very distinct dewetting morphologies. For large ratios of array period to micropillar height and width, the dewetted areas tend to have a diamond-like shape and expand with a rate similar to a flat, unpatterned substrate. When the array period is reduced, the morphology of the dry spot becomes irregular and its expansion rate is significantly reduced. We developed a fully coupled numerical model of the dewetting process that reproduces the key features observed in experiments. Moreover, we performed contact mechanics simulations to characterize the deformation of the elastomer and the shape of the dewetted area in a unit cell of the micropillar array.
Effect of Subsurface Microstructures on Adhesion of Highly Confined Elastic Films
2021, Samri, Manar, Kossa, Attila, Hensel, René
Polymer adhesive films sandwiched between two rigid solids are a common bonding strategy. The mechanics and consequently the adhesion of such geometrically confined films depend mainly on their thickness, Young's modulus, and the Poisson's ratio of the material. In this work, we explore the effect of a micropatterned subsurface embedded into the adhesive layer. We compare experiments with three-dimensional numerical simulations to evaluate the impact of the microstructure on the contact stiffness and effective modulus. The results are used to extend a previously proposed size scaling argument on adhesion from incompressible to slightly compressible films to account for the silicone used in our study with a Poisson's ratio of 0.495. In addition, interfacial stress distributions between the elastic film and the glass disc are obtained from plane strain simulations to evaluate characteristic adhesion failures such as edge cracks and cavitation. Overall, the micropatterned subsurface has a large impact on the contact stiffness, the interfacial stress distribution, and the detachment behavior; however, the adhesion performance is only slightly improved in comparison to a non-patterned subsurface.
Switchable Underwater Adhesion by Deformable Cupped Microstructures
2020, Wang, Yue, Kang, Victor, Federle, Walter, Arzt, Eduard, Hensel, René
Switchable underwater adhesion can be useful for numerous applications, but is extremely challenging due to the presence of water at the contact interface. Here, deformable cupped microstructures (diameter typically 100 µm, rim thickness 5 µm) are reported that can switch between high (≈1 MPa) and low (<0.2 MPa) adhesion strength by adjusting the retraction velocity from 100 to 0.1 µm s–1. The velocity at which the switch occurs is determined by specific design parameters of the cupped microstructure, such as the cup width and angle. The results are compared with theoretical estimates of water penetration into the contact zone and expansion of the cup during retraction. This work paves the way for controlling wet adhesion on demand and may inspire further applications in smart adhesives.
A Design Strategy for Mushroom-Shaped Microfibrils With Optimized Dry Adhesion: Experiments and Finite Element Analyses
2021, Zhang, Xuan, Wang, Yue, Hensel, René, Arzt, Eduard
Enhanced dry adhesion of micropatterned polymeric surfaces has been frequently demonstrated. Among the design parameters, the cap geometry plays an important role to improve their performance. In this study, we combined experiments on single polyurethane mushroom-shaped fibrils (with a stalk diameter of 80 µm and height of 125 µm) against flat glass, with numerical simulations implementing a cohesive zone. We found that the geometry of the mushroom cap strongly affects the interfacial crack behavior and the pull-off stress. The experimental and numerical results suggest that optimal adhesion was accompanied by the appearance of both edge and interior interfacial cracks during separation. Finite elemental analyses revealed the evolution of the interfacial stress distributions as a function of the cap thickness and confirmed the distinct detachment mechanisms. Furthermore, the effect of the stalk diameter and the Young's modulus on the adhesive force was established, resulting in an optimal design for mushroom-shaped fibrils.
Bioinspired Underwater Adhesion to Rough Substrates by Cavity Collapse of Cupped Microstructures
2021, Wang, Yue, Hensel, René
Underwater or wet adhesion is highly desirable for numerous applications but is counteracted by the liquids in the contact which weaken intermolecular attraction. The problem is exacerbated in conjunction with surface roughness when liquids partially remain in grooves or dimples of the substrate. In the present study, a cupped microstructure with a cavity inspired by suction organs of aquatic animals is proposed. The microstructures (cup radius of 100 µm) are made from polyurethane using two-photon lithography followed by replica molding. Adhesion to rough substrates is emulated experimentally by a micropatterned model substrate with varying channel widths. Pull-off stresses are found to be about 200 kPa, i.e., twice atmospheric pressure. Evaluation of force–displacement curves together with in situ observations reveal the adhesion mechanism, which involves adaptation to surface roughness and an elastic force induced by the collapse of the cavity that holds sealed contact with the substrate during retraction. This new microarchitecture may pave the way for next generation microstructures applicable to real, rough surfaces under wet conditions.