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    Soft Inkjet Circuits: Rapid Multi-Material Fabrication of Soft Circuits using a Commodity Inkjet Printer
    (New York City : Association for Computing Machinery, 2019) Khan, Arshad; Roo, Joan Sol; Kraus, Tobias; Steimle, Jürgen
    Despite the increasing popularity of soft interactive devices, their fabrication remains complex and time consuming. We contribute a process for rapid do-it-yourself fabrication of soft circuits using a conventional desktop inkjet printer. It supports inkjet printing of circuits that are stretchable, ultrathin, high resolution, and integrated with a wide variety of materials used for prototyping. We introduce multi-ink functional printing on a desktop printer for realizing multi-material devices, including conductive and isolating inks. We further present DIY techniques to enhance compatibility between inks and substrates and the circuits' elasticity. This enables circuits on a wide set of materials including temporary tattoo paper, textiles, and thermoplastic. Four application cases demonstrate versatile uses for realizing stretchable devices, e-textiles, body-based and re-shapeable interfaces.
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    Ultrathin gold nanowires for transparent electronics: breaking barriers
    (Amsterdam : Elsevier, 2016) Gonzalez-Garcia, Lola; Maurer, Johannes H.M.; Reiser, Beate; Kanelidis, Ioannis; Kraus, Tobias
    Novel types of Transparent Conductive Materials (TCMs) based on metal nanostructures are discussed. Dispersed metal nanoparticles can be deposited from liquids with moderate thermal budgets to form conductive films that are suitable for thin-film solar cells, displays, touch screens, and nanoelectronics. We aim at new TCMs that combine high electrical conductivity with optical transparency and mechanical flexibility. Wet-processed films of randomly arranged metallic nanowires networks are commercially established and provide a relatively cost-effective, scalable production. Ultrathin gold nanowires (AuNWs) with diameters below 2 nm and high aspect ratios have recently become available. They combine mechanical flexibility, high optical transparency, and chemical inertness. AuNWs carry oleylamine capping ligands from synthesis that cause high contact resistances at their junctions. We investigated different annealing processes based on temperature and plasma treatment, to remove the ligands after deposition and to allow electrical conductivity. Their effect on the resulting nanostructure and on the material properties was studied. Scanning Electron Microscopy (SEM) and optical spectroscopy revealed changes in the microstructure for the different post-treatments. We found that the conductivity and the stability of the TCM depended strongly on its final microstructure. We demonstrate that the best results are obtained using H2-plasma treatment.