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- ItemFailure mechanism analysis based on laser-based surface treatments for aluminum-polyamide laser joining(Amsterdam [u.a.] : Elsevier, 2021) Elahi, Amne; Koch, Marcus; Bardon, Julien; Addiego, Frédéric; Plapper, PeterThe development of strong metal to polymer assemblies is currently an important research subject thanks to its prominence to develop lightweight structures. Furthermore, laser welding is known to be a fast, reliable, and versatile joining process, and it was demonstrated recently that it can be applied to such metal to polymer systems. To enhance the mechanical properties of the laser-joined aluminum-polyamide (Al-PA) specimens, laser polishing and laser ablation processes have been implemented on the aluminum surface before joining. The polyamide surface was also treated with the laser beam, separately. The surfaces were tested by several characterization techniques before and after each surface treatment. Then aluminum and polyamide samples with different surface treatments have been joined with an identical laser joining process. The mechanical properties of the joints in single lap shear configuration are reported and the failure mechanisms are discussed based on micro-computed x-ray tomography imaging of joined specimens and microscopic analysis before failure. Results show that both surface treatments of aluminum significantly improve the shear load of the joint; however, with different failure mechanisms. Polyamide surface treatment and increasing degree of crystallinity are effective when combined with the laser polishing of the Al surface. This combination is responsible for further enhancement of the shear load of the joint to the limit of base metal strength which is approximately 60 % improvement compared to the untreated samples. Finally, energy dispersive X-ray mapping shows the physicochemical bonding between aluminum oxide and polyamide at the interface.
- ItemEffect of Subsurface Microstructures on Adhesion of Highly Confined Elastic Films(New York, NY : ASME, 2021) Samri, Manar; Kossa, Attila; Hensel, RenéPolymer adhesive films sandwiched between two rigid solids are a common bonding strategy. The mechanics and consequently the adhesion of such geometrically confined films depend mainly on their thickness, Young's modulus, and the Poisson's ratio of the material. In this work, we explore the effect of a micropatterned subsurface embedded into the adhesive layer. We compare experiments with three-dimensional numerical simulations to evaluate the impact of the microstructure on the contact stiffness and effective modulus. The results are used to extend a previously proposed size scaling argument on adhesion from incompressible to slightly compressible films to account for the silicone used in our study with a Poisson's ratio of 0.495. In addition, interfacial stress distributions between the elastic film and the glass disc are obtained from plane strain simulations to evaluate characteristic adhesion failures such as edge cracks and cavitation. Overall, the micropatterned subsurface has a large impact on the contact stiffness, the interfacial stress distribution, and the detachment behavior; however, the adhesion performance is only slightly improved in comparison to a non-patterned subsurface.
- ItemA Design Strategy for Mushroom-Shaped Microfibrils With Optimized Dry Adhesion: Experiments and Finite Element Analyses(New York, NY : ASME, 2021) Zhang, Xuan; Wang, Yue; Hensel, René; Arzt, EduardEnhanced dry adhesion of micropatterned polymeric surfaces has been frequently demonstrated. Among the design parameters, the cap geometry plays an important role to improve their performance. In this study, we combined experiments on single polyurethane mushroom-shaped fibrils (with a stalk diameter of 80 µm and height of 125 µm) against flat glass, with numerical simulations implementing a cohesive zone. We found that the geometry of the mushroom cap strongly affects the interfacial crack behavior and the pull-off stress. The experimental and numerical results suggest that optimal adhesion was accompanied by the appearance of both edge and interior interfacial cracks during separation. Finite elemental analyses revealed the evolution of the interfacial stress distributions as a function of the cap thickness and confirmed the distinct detachment mechanisms. Furthermore, the effect of the stalk diameter and the Young's modulus on the adhesive force was established, resulting in an optimal design for mushroom-shaped fibrils.
- ItemMicro-mechanical response of ultrafine grain and nanocrystalline tantalum(Rio de Janeiro : Elsevier, 2021) Yang, Wen; Ruestes, Carlos J.; Li, Zezhou; Torrents Abad, Oscar; Langdon, Terence G.; Heiland, Birgit; Koch, Marcus; Arzt, Eduard; Meyers, Marc A.In order to investigate the effect of grain boundaries on the mechanical response in the micrometer and submicrometer levels, complementary experiments and molecular dynamics simulations were conducted on a model bcc metal, tantalum. Microscale pillar experiments (diameters of 1 and 2 μm) with a grain size of ~100–200 nm revealed a mechanical response characterized by a yield stress of ~1500 MPa. The hardening of the structure is reflected in the increase in the flow stress to 1700 MPa at a strain of ~0.35. Molecular dynamics simulations were conducted for nanocrystalline tantalum with grain sizes in the range of 20–50 nm and pillar diameters in the same range. The yield stress was approximately 6000 MPa for all specimens and the maximum of the stress–strain curves occurred at a strain of 0.07. Beyond that strain, the material softened because of its inability to store dislocations. The experimental results did not show a significant size dependence of yield stress on pillar diameter (equal to 1 and 2 um), which is attributed to the high ratio between pillar diameter and grain size (~10–20). This behavior is quite different from that in monocrystalline specimens where dislocation ‘starvation’ leads to a significant size dependence of strength. The ultrafine grains exhibit clear ‘pancaking’ upon being plastically deformed, with an increase in dislocation density. The plastic deformation is much more localized for the single crystals than for the nanocrystalline specimens, an observation made in both modeling and experiments. In the molecular dynamics simulations, the ratio of pillar diameter (20–50 nm) to grain size was in the range 0.2–2, and a much greater dependence of yield stress to pillar diameter was observed. A critical result from this work is the demonstration that the important parameter in establishing the overall deformation is the ratio between the grain size and pillar diameter; it governs the deformation mode, as well as surface sources and sinks, which are only important when the grain size is of the same order as the pillar diameter.
- ItemTailored polyurethane acrylate blend for large-scale and high-performance micropatterned dry adhesives(Dordrecht [u.a.] : Springer Science + Business Media B.V, 2019) Yu, Dan; Hensel, René; Beckelmann, Dirk; Opsölder, Michael; Schäfer, Bruno; Moh, Karsten; de Oliveira, Peter William; Arzt, EduardContinuous roll-to-roll fabrication is essential for transferring the idea of bio-inspired, fibrillar dry adhesives into large-scale, synthetic, high-performance adhesive tapes. Toward this aim, we investigated process parameters that allow us to control the morphology and the resulting adhesion of mushroom-shaped micropatterned surfaces. Flexible silicone templates enabled the replication process of the polyurethane acrylate pre-polymer involving UV-light-induced cross-linking. For this paper, we particularly tailored the polyurethane acrylate pre-polymer by adding chemical components to tune UV curing kinetics and to reduce oxygen inhibition of radicals. We found that higher intensities of the UV light and faster reaction kinetics improved the quality of the microstructures, i.e., a larger cap diameter of the mushroom tips was achieved. The polymer blend U6E4 exhibited the fastest curing kinetics, which resulted in a micromorphology similar to that of the Ni-shim master structures. Best adhesion results were obtained for adhesive tapes made from U6E4 with 116 kPa pull-off stress, 1.4 N cm−1 peel strength and 71 kPa shear strength. In addition, repeated attachment–detachment tests over 100,000 cycles demonstrated strong robustness and reusability.
- ItemMechanochemical Ionization: Differentiating Pressure-, Shear-, and Temperature-Induced Reactions in a Model Phosphate(Cham : Springer International Publishing, 2022) Sukhomlinov, Sergey V.; Kickelbick, Guido; Müser, Martin H.Using density-functional theory-based molecular dynamics simulations, we study stress and temperature-induced chemical reactions in bulk systems containing triphosphoric acid and zinc phosphate molecules. The nature of the products depends sensitively on the imposed conditions, e.g., isotropic and even more so shear stress create (zwitter-) ionic products. Free ions also emerge from thermal cycles, but the reactions are endothermic rather than exothermic as for stress-induced transitions and zinc atoms remain four-coordinated. Hydrostatic stresses required for reactions to occur lie well below those typical for tribological micro-contacts of stiff solids and are further reduced by shear. Before zinc atoms change their coordination under stress, proton mobility increases, i.e., hydrogen atoms start to change the oxygen atom they are bonded to within 10 ps time scales. The hydrostatic stress for this to occur is reduced with increasing shear. Our finding suggests that materials for which number, nature, and mobility of ions are stress sensitive cannot have a well-defined position in the triboelectric series, since local contact stresses generally depend on the stiffness of the counter body. Moreover, our simulations do not support the idea that chemical reactions in a tribo-contact are commonly those that would be obtained through heating alone.
- ItemUnderstanding the charging of supercapacitors by electrochemical quartz crystal microbalance(Cambridge : Royal Society of Chemistry, 2022) Niu, Liang; Yang, Long; Yang, Jingjing; Chen, Ming; Zeng, Liang; Duan, Pan; Wu, Taizheng; Pameté, Emmanuel; Presser, Volker; Feng, GuangSupercapacitors are highly valued energy storage devices with high power density, fast charging ability, and exceptional cycling stability. A profound understanding of their charging mechanisms is crucial for continuous performance enhancement. Electrochemical quartz crystal microbalance (EQCM), a detection means that provides in situ mass change information during charging–discharging processes at the nanogram level, has received greatly significant attention during the past decade due to its high sensitivity, non-destructiveness and low cost. Since being used to track ionic fluxes in porous carbons in 2009, EQCM has played a pivotal role in understanding the charging mechanisms of supercapacitors. Herein, we review the critical progress of EQCM hitherto, including theory fundamentals and applications in supercapacitors. Finally, we discuss the fundamental effects of ion desolvation and transport on the performance of supercapacitors. The advantages and defects of applying EQCM in supercapacitors are thoroughly examined, and future directions are proposed.