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Author: Einfeldt, S. × Subject: light emitting diode ×

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    Low resistance n-contact for UVC LEDs by a two-step plasma etching process
    (Bristol : IOP Publ., 2020) Cho, H.K.; Kang, J.H.; Sulmoni, L.; Kunkel, K.; Rass, J.; Susilo, N.; Wernicke, T.; Einfeldt, S.; Kneissl, M.
    The impact of plasma etching on the formation of low-resistance n-contacts on the AlGaN:Si current spreading layer during the chip fabrication of ultraviolet light-emitting diodes (UV LEDs) emitting at 265 nm is investigated. A two-step plasma etching process with a first rapid etching using BCl3/Cl2 gas mixture and a second slow etching step using pure Cl2 gas has been developed. The etching sequence provides smooth mesa side-walls and an n-AlGaN surface with reduced surface damage. Ohmic n-contacts with a contact resistivity of 3.5 10-4 Ωcm2 are obtained on Si-doped Al0.65Ga0.35N layers and the operating voltages of the UVC LEDs were reduced by 2 V for a current of 20 mA. © 2020 The Author(s). Published by IOP Publishing Ltd.