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Author: Hensel, René × End date: 2024 × Start date: 2020 × DDC: 670 ×

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Now showing 1 - 4 of 4
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    Application of machine learning to object manipulation with bio-inspired microstructures
    (Rio de Janeiro : Elsevier, 2023) Samri, Manar; Thiemecke, Jonathan; Hensel, René; Arzt, Eduard
    Bioinspired fibrillar adhesives have been proposed for novel gripping systems with enhanced scalability and resource efficiency. Here, we propose an in-situ optical monitoring system of the contact signatures, coupled with image processing and machine learning. Visual features were extracted from the contact signature images recorded at maximum compressive preload and after lifting a glass object. The algorithm was trained to cope with several degrees of misalignment and with unbalanced weight distributions by off-center gripping. The system allowed an assessment of the picking process for objects of various mass (200, 300, and 400 g). Several classifiers showed a high accuracy of about 90 % for successful prediction of attachment, depending on the mass of the object. The results promise improved reliability of handling objects, even in difficult situations.
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    Effect of Subsurface Microstructures on Adhesion of Highly Confined Elastic Films
    (New York, NY : ASME, 2021) Samri, Manar; Kossa, Attila; Hensel, René
    Polymer adhesive films sandwiched between two rigid solids are a common bonding strategy. The mechanics and consequently the adhesion of such geometrically confined films depend mainly on their thickness, Young's modulus, and the Poisson's ratio of the material. In this work, we explore the effect of a micropatterned subsurface embedded into the adhesive layer. We compare experiments with three-dimensional numerical simulations to evaluate the impact of the microstructure on the contact stiffness and effective modulus. The results are used to extend a previously proposed size scaling argument on adhesion from incompressible to slightly compressible films to account for the silicone used in our study with a Poisson's ratio of 0.495. In addition, interfacial stress distributions between the elastic film and the glass disc are obtained from plane strain simulations to evaluate characteristic adhesion failures such as edge cracks and cavitation. Overall, the micropatterned subsurface has a large impact on the contact stiffness, the interfacial stress distribution, and the detachment behavior; however, the adhesion performance is only slightly improved in comparison to a non-patterned subsurface.
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    A Design Strategy for Mushroom-Shaped Microfibrils With Optimized Dry Adhesion: Experiments and Finite Element Analyses
    (New York, NY : ASME, 2021) Zhang, Xuan; Wang, Yue; Hensel, René; Arzt, Eduard
    Enhanced dry adhesion of micropatterned polymeric surfaces has been frequently demonstrated. Among the design parameters, the cap geometry plays an important role to improve their performance. In this study, we combined experiments on single polyurethane mushroom-shaped fibrils (with a stalk diameter of 80 µm and height of 125 µm) against flat glass, with numerical simulations implementing a cohesive zone. We found that the geometry of the mushroom cap strongly affects the interfacial crack behavior and the pull-off stress. The experimental and numerical results suggest that optimal adhesion was accompanied by the appearance of both edge and interior interfacial cracks during separation. Finite elemental analyses revealed the evolution of the interfacial stress distributions as a function of the cap thickness and confirmed the distinct detachment mechanisms. Furthermore, the effect of the stalk diameter and the Young's modulus on the adhesive force was established, resulting in an optimal design for mushroom-shaped fibrils.
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    Adhesion of a cylindrical punch with elastic properties that vary radially
    (Amsterdam [u.a.] : Elsevier, 2023) Kossa, Attila; Hensel, René; McMeeking, Robert M.
    The adhesion of a rigid substrate and an adhered straight cylindrical punch with a non-homogeneous elastic modulus is analyzed. The stress distributions are obtained along the interface for various elastic modulus gradients. The calculations are performed in the commercial finite element software Abaqus using a user material (UMAT) subroutine to control the dependence of Young's modulus on the radial position. The UMAT code is shared in the paper. The results reveal that the decreasing elastic modulus toward the perimeter of the punch can be used to significantly reduce the normal stress magnitudes in the singularity domain, which leads to stronger adhesion. The increase in the adhesion strength is characterized numerically. The effect of Poisson's ratio is also analyzed.