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Author: Hippler, R. ×

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    Behavior of a porous particle in a radiofrequency plasma under pulsed argon ion beam bombardment
    (College Park, MD : Institute of Physics Publishing, 2010) Wiese, R.; Sushkov, V.; Kersten, H.; Ikkurthi, V.R.; Schneider, R.; Hippler, R.
    The behavior of a single porous particle with a diameter of 250 μm levitating in a radiofrequency (RF) plasma under pulsed argon ion beam bombardment was investigated. The motion of the particle under the action of the ion beam was observed to be an oscillatory motion. The Fourier-analyzed motion is dominated by the excitation frequency of the pulsed ion beam and odd higher harmonics, which peak near the resonance frequency. The appearance of even harmonics is explained by a variation of the particles's charge depending on its position in the plasma sheath. The Fourier analysis also allows a discussion of neutral and ion forces. The particle's charge was derived and compared with theoretical estimates based on the orbital motion-limited (OML) model using also a numerical simulation of the RF discharge. The derived particle's charge is about 7-15 times larger than predicted by the theoretical models. This difference is attributed to the porous structure of the particle. © IOP Publishing Ltd and Deutsche Physikalische Gesellschaft.
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    Analysis of the release characteristics of Cu-treated antimicrobial implant surfaces using atomic absorption spectrometry
    (New York, NY : Hindawi, 2012) Zietz, C.; Fritsche, A.; Finke, B.; Stranak, V.; Haenle, M.; Hippler, R.; Mittelmeier, W.; Bader, R.
    New developments of antimicrobial implant surfaces doped with copper (Cu) ions may minimize the risk of implant-associated infections. However, experimental evaluation of the Cu release is influenced by various test parameters. The aim of our study was to evaluate the Cu release characteristics in vitro according to the storage fluid and surface roughness. Plasma immersion ion implantation of Cu (Cu-PIII) and pulsed magnetron sputtering process of a titanium copper film (Ti-Cu) were applied to titanium alloy (Ti6Al4V) samples with different surface finishing of the implant material (polished, hydroxyapatite and corundum blasted). The samples were submersed into either double-distilled water, human serum, or cell culture medium. Subsequently, the Cu concentration in the supernatant was measured using atomic absorption spectrometry. The test fluid as well as the surface roughness can alter the Cu release significantly, whereby the highest Cu release was determined for samples with corundum-blasted surfaces stored in cell medium.