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    Ultrathin gold nanowires for transparent electronics: breaking barriers
    (Amsterdam : Elsevier, 2016) Gonzalez-Garcia, Lola; Maurer, Johannes H.M.; Reiser, Beate; Kanelidis, Ioannis; Kraus, Tobias
    Novel types of Transparent Conductive Materials (TCMs) based on metal nanostructures are discussed. Dispersed metal nanoparticles can be deposited from liquids with moderate thermal budgets to form conductive films that are suitable for thin-film solar cells, displays, touch screens, and nanoelectronics. We aim at new TCMs that combine high electrical conductivity with optical transparency and mechanical flexibility. Wet-processed films of randomly arranged metallic nanowires networks are commercially established and provide a relatively cost-effective, scalable production. Ultrathin gold nanowires (AuNWs) with diameters below 2 nm and high aspect ratios have recently become available. They combine mechanical flexibility, high optical transparency, and chemical inertness. AuNWs carry oleylamine capping ligands from synthesis that cause high contact resistances at their junctions. We investigated different annealing processes based on temperature and plasma treatment, to remove the ligands after deposition and to allow electrical conductivity. Their effect on the resulting nanostructure and on the material properties was studied. Scanning Electron Microscopy (SEM) and optical spectroscopy revealed changes in the microstructure for the different post-treatments. We found that the conductivity and the stability of the TCM depended strongly on its final microstructure. We demonstrate that the best results are obtained using H2-plasma treatment.
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    The role of ligands in coinage-metal nanoparticles for electronics
    (Frankfurt, M. : Beilstein-Institut zur Förderung der Chemischen Wissenschaften, 2017) Kanelidis, Ioannis; Kraus, Tobias
    Coinage-metal nanoparticles are key components of many printable electronic inks. They can be combined with polymers to form conductive composites and have been used as the basis of molecular electronic devices. This review summarizes the multidimensional role of surface ligands that cover their metal cores. Ligands not only passivate crystal facets and determine growth rates and shapes; they also affect size and colloidal stability. Particle shapes can be tuned via the ligand choice while ligand length, size, ω-functionalities, and chemical nature influence shelf-life and stability of nanoparticles in dispersions. When particles are deposited, ligands affect the electrical properties of the resulting film, the morphology of particle films, and the nature of the interfaces. The effects of the ligands on sintering, cross-linking, and self-assembly of particles in electronic materials are discussed.