4 results
Search Results
Now showing 1 - 4 of 4
- ItemStatus and Prospects of AlN Templates on Sapphire for Ultraviolet Light-Emitting Diodes(Weinheim : Wiley-VCH, 2020) Hagedorn, Sylvia; Walde, Sebastian; Knauer, Arne; Susilo, Norman; Pacak, Daniel; Cancellara, Leonardo; Netzel, Carsten; Mogilatenko, Anna; Hartmann, Carsten; Wernicke, Tim; Kneissl, Michael; Weyers, MarkusHerein, the scope is to provide an overview on the current status of AlN/sapphire templates for ultraviolet B (UVB) and ultraviolet C (UVC) light-emitting diodes (LEDs) with focus on the work done previously. Furthermore, approaches to improve the properties of such AlN/sapphire templates by the combination of high-temperature annealing (HTA) and patterned AlN/sapphire interfaces are discussed. While the beneficial effect of HTA is demonstrated for UVC LEDs, the growth of relaxed AlGaN buffer layers on HTA AlN is a challenge. To achieve relaxed AlGaN with a low dislocation density, the applicability of HTA for AlGaN is investigated. © 2020 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
- ItemImproved Efficiency of Ultraviolet B Light-Emitting Diodes with Optimized p-Side(Weinheim : Wiley-VCH, 2020) Kolbe, Tim; Knauer, Arne; Rass, Jens; Cho, Hyun Kyong; Mogilatenko, Anna; Hagedorn, Sylvia; Lobo Ploch, Neysha; Einfeldt, Sven; Weyers, MarkusThe effects of design and thicknesses of different optically transparent p-current spreading layers [short-period superlattice, superlattice (SL), and bulk p- (Formula presented.)] as well as the type and thickness of the p-GaN cap layer on the electrical and optical characteristics of 310 nm ultraviolet light-emitting diodes (LEDs) are investigated. Scanning transmission electron microscopy measurements display self-organized composition variations in the nonpseudomorphically grown SLs, reducing the effect of increased hole injection efficiency of a SL. In addition, the effect leads to an increased operation voltage. In contrast, the bulk p-AlGaN layer has a uniform composition and the corresponding LEDs show only a slightly lower output power along with a lower operating voltage. If the thickness of the p-AlGaN bulk layer in the LED is reduced from 150 nm to 50 nm, the output power increases and the operating voltage decreases. Finally, LEDs with a nonuniform (Formula presented.) -GaN cap layer from a 3D island-like growth mode feature the highest output power and operating voltage. In contrast, the output power and operating voltage of LEDs with a smooth and closed cap depend on the thickness of (Formula presented.) -GaN. The highest output power and lowest operating voltage are achieved for LEDs with the thinnest (Formula presented.) -GaN cap. © 2020 The Authors. Published by Wiley-VCH GmbH
- ItemHigh‐Temperature Annealing and Patterned AlN/Sapphire Interfaces(Weinheim : Wiley-VCH, 2021) Hagedorn, Sylvia; Mogilatenko, Anna; Walde, Sebastian; Pacak, Daniel; Weinrich, Jonas; Hartmann, Carsten; Weyers, MarkusUsing the example of epitaxial lateral overgrowth of AlN on trench-patterned AlN/sapphire templates, the impact of introducing a high-temperature annealing step into the process chain is investigated. Covering the open surfaces of sapphire trench sidewalls with a thin layer of AlN is found to be necessary to preserve the trench shape during annealing. Both the influence of annealing temperature and annealing duration are investigated. To avoid the deformation of the AlN/sapphire interface during annealing, the annealing duration or annealing temperature must be low enough. Annealing for 1 h at 1730 °C is found to allow for the lowest threading dislocation density of 3.5 × 108 cm−2 in the subsequently grown AlN, while maintaining an uncracked smooth surface over the entire 2 in. wafer. Transmission electron microscopy study confirms the defect reduction by high-temperature annealing and reveals an additional strain relaxation mechanism by accumulation of horizontal dislocation lines at the interface between annealed and nonannealed AlN. By applying a second annealing step, the dislocation density can be further reduced to 2.5 × 108 cm−2.
- ItemTemperature Dependence of Dark Spot Diameters in GaN and AlGaN(Weinheim : Wiley-VCH, 2021) Netzel, Carsten; Knauer, Arne; Brunner, Frank; Mogilatenko, Anna; Weyers, MarkusThreading dislocations in c-plane (Al,Ga)N layers are surrounded by areas with reduced light generation efficiency, called “dark spots.” These areas are observable in luminescence measurements with spatial resolution in the submicrometer range. Dark spots reduce the internal quantum efficiency in single layers and light-emitting devices. In cathodoluminescence measurements, the diameter of dark spots (full width at half maximum [FWHM]) is observed to be 200–250 nm for GaN. It decreases by 30–60% for AlxGa1−xN with x ≈ 0.5. Furthermore, the dark spot diameter increases with increasing temperature from 83 to 300 K in AlGaN, whereas it decreases in GaN. Emission energy mappings around dark spots become less smooth and show sharper features on submicrometer scales at low temperature for AlGaN and, on the contrary, at high temperature for GaN. It is concluded that charge carrier localization dominates the temperature dependence of dark spot diameters and of the emission energy distribution around threading dislocations in AlGaN, whereas the temperature-dependent excitation volume in cathodoluminescence and charge carrier diffusion limited by phonon scattering are the dominant effects in GaN. Consequently, with increasing temperature, nonradiative recombination related to threading dislocations extends to wider regions in AlGaN, whereas it becomes spatially limited in GaN.