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    Symmetry‐Induced Selective Excitation of Topological States in Su–Schrieffer–Heeger Waveguide Arrays
    (Weinheim : Wiley-VCH, 2023) Tang, Min; Wang, Jiawei; Valligatla, Sreeramulu; Saggau, Christian N.; Dong, Haiyun; Saei Ghareh Naz, Ehsan; Klembt, Sebastian; Lee, Ching Hua; Thomale, Ronny; van den Brink, Jeroen; Fulga, Ion Cosma; Schmidt, Oliver G.; Ma, Libo
    The investigation of topological state transition in carefully designed photonic lattices is of high interest for fundamental research, as well as for applied studies such as manipulating light flow in on-chip photonic systems. Herein, the topological phase transition between symmetric topological zero modes (TZM) and antisymmetric TZMs in Su–Schrieffer–Heeger mirror symmetric waveguides is reported. The transition of TZMs is realized by adjusting the coupling ratio between neighboring waveguide pairs, which is enabled by selective modulation of the refractive index in the waveguide gaps. Bidirectional topological transitions between symmetric and antisymmetric TZMs can be achieved with proposed switching strategy. Selective excitation of topological edge mode is demonstrated owing to the symmetry characteristics of the TZMs. The flexible manipulation of topological states is promising for on-chip light flow control and may spark further investigations on symmetric/antisymmetric TZM transitions in other photonic topological frameworks.
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    Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications
    (Weinheim : Wiley-VCH, 2020) Saggau, Christian N.; Gabler, Felix; Karnaushenko, Dmitriy D.; Karnaushenko, Daniil; Ma, Libo; Schmidt, Oliver G.
    Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics. © 2020 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim