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End date: 2023 × Start date: 2023 × DDC: 620 × Has files: Yes × WGL Institute: FBH ×

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    Wavelength-stabilized ns-pulsed 2.2 kW diode laser bar with multiple active regions and tunnel junctions
    (Stevenage : IET, 2022) Ammouri, Nor; Christopher, Heike; Fricke, Jörg; Ginolas, Arnim; Liero, Armin; Maaßdorf, Andre; Wenzel, Hans; Knigge, Andrea
    The improvement of the performance of a distributed Bragg reflector laser bar emitting near 905 nm through the use of multiple epitaxially stacked active regions and tunnel junctions is reported. The bar consisting of 48 emitters (each having an aperture of 50 µm) emits an optical power of 2.2 kW in 8 ns long pulses at an injection current of 1.1 kA. This corresponds to an almost threefold increase of the pulse power compared to a bar with lasers having only a single active region. Due to the integrated surface Bragg grating, the bar exhibits a narrow spectral bandwidth of about 0.3 nm and a thermal tuning of only 68 pm/K.
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    Simulation and analysis of high-brightness tapered ridge-waveguide lasers
    (Dordrecht [u.a.] : Springer Science + Business Media B.V, 2023) Koester, Jan-Philipp; Wenzel, Hans; Wilkens, Martin; Knigge, Andrea
    In this work, a simulation-based analysis of a CW-driven tapered ridge-waveguide laser design is presented. Measurements of these devices delivered high lateral brightness values of 4 W · mm - 1mrad - 1 at 2.5W optical output power. First, active laser simulations are performed to reproduce these results. Next, the resulting complex valued intra-cavity refractive index distributions are the basis for a modal and beam propagation analysis, which demonstrates the working principle and limitation of the underlying lateral mode filter effect. Finally, the gained understanding is the foundation for further design improvements leading to lateral brightness values of up to 10 W · mm - 1mrad - 1 predicted by simulations.
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    Effects of post metallization annealing on Al2O3 atomic layer deposition on n-GaN
    (Bristol : IOP Publ., 2022) Tadmor, Liad; Brusaterra, Enrico; Treidel, Eldad Bahat; Brunner, Frank; Bickel, Nicole; Vandenbroucke, Sofie S. T.; Detavernier, Christophe; Würfl, Joachim; Hilt, Oliver
    The chemical, physical and electrical properties and the robustness of post metallization annealed Al2O3 atomic layers deposited on n-type GaN are investigated in this work. Planar metal insulator capacitors are used to demonstrate a gate-first with following ohmic contacts formation at elevated temperature up to 600 °C process flow. X-ray photoelectron spectroscopy indicates that no new bonds in the Al2O3 layer are formed due to exposure to the elevated annealing temperature. X-ray diffraction measurements show no crystallization of the oxide layer. Atomic force microscopy shows signs of degradation of the sample annealed at 600 °C. Electrical measurements indicate that the elevated annealing temperature results in an increase of the oxide depletion and the deep depletion capacitances simultaneously, that results in a reduction of the flat band voltage to zero, which is explained by fixed oxide charges curing. A forward bias step stress capacitance measurement shows that the total number of induced trapped charges are not strongly affected by the elevated annealing temperatures. Interface trap density of states analysis shows the lowest trapping concentration for the capacitor annealed at 500 °C. Above this temperature, the interface trap density of states increases. When all results are taken into consideration, we have found that the process thermal budget allows for an overlap between the gate oxide post metallization annealing and the ohmic contact formation at 500 °C.