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End date: 2016 × Start date: 2016 × DDC: 620 × Has files: Yes × Publisher: Amsterdam : Elsevier ×

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    On the process of co-deformation and phase dissolution in a hard-soft immiscible CuCo alloy system during high-pressure torsion deformation
    (Amsterdam : Elsevier, 2016) Bachmaier, Andrea; Schmauch, Jörg; Aboulfadl, Hisham; Verch, Andreas; Motz, Christian
    In this study, dual phase Cusingle bondCo composites with a total immiscibility in the solid state and a very different initial phase strength are deformed by severe plastic deformation. Nanocrystalline supersaturated solid solutions are reached in all Cusingle bondCo composites independent of the initial composition. The deformation and mechanical mixing process is studied thoroughly by combining scanning electron microscopy, transmission electron microscopy, three-dimensional atom probe tomography and nanoindentation. The indentation hardness of the Cu and Co phase and its evolution as a function of the applied strain is linked to deformation and mechanical mixing process to gain a better understanding how the phase strength mismatch of the Cu and Co phase effects the amount of co-deformation and deformation-induced mixing. Our results show that co-deformation is not a necessary requirement to achieve mechanical mixing.
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    Numerical study of adhesion enhancement by composite fibrils with soft tip layers
    (Amsterdam : Elsevier, 2016) Balijepalli, Ram Gopal; Fischer, Sarah C.L.; Hensel, René; McMeeking, Robert M.; Arzt, Eduard
    Bio-inspired fibrillar surfaces with reversible adhesion to stiff substrates have been thoroughly investigated over the last decade. In this paper we propose a novel composite fibril consisting of a soft tip layer and stiffer stalk with differently shaped interfaces (flat vs. curved) between them. A tensile stress is applied remotely on the free end of the fibril whose other end adheres to a rigid substrate. The stress distributions and the resulting adhesion of such structures were numerically investigated under plane strain (2D) and axisymmetric (3D) conditions. The stress intensities were evaluated for different combinations of layer thickness and Young’s moduli. The adhesion strength values were found to increase for thinner layers and larger modulus ratio; these trends are also reflected in selected experimental results. The results of this paper provide a new strategy for optimizing adhesion strength of fibrillar surfaces.
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    Electrospinning and electrospraying of silicon oxycarbide-derived nanoporous carbon for supercapacitor electrodes
    (Amsterdam : Elsevier, 2016) Tolosa, Aura; Krüner, Benjamin; Jäckel, Nicolas; Aslan, Mesut; Vakifahmetoglu, Cekdar; Presser, Volker
    In this study, carbide-derived carbon fibers from silicon oxycarbide precursor were synthesized by electrospinning of a commercially available silicone resin without adding a carrier polymer for the electrospinning process. The electrospun fibers were pyrolyzed yielding SiOC. Modifying the synthesis procedure, we were able to obtain electrosprayed SiOC beads instead of fibers. After chlorine treatment, nanoporous carbon with a specific surface area of up to 2394 m2·g-1 was obtained (3089 m2·g-1 BET). Electrochemical characterization of the SiOC-CDC either as free-standing fiber mat electrodes or polymer-bound bead films was performed in 1 M tetraethylammonium tetrafluoroborate in acetonitrile (TEA-BF4 in ACN). The electrospun fibers presented a high gravimetric capacitance of 135 F·g-1 at 10 mV·s-1 and a very high power handling, maintaining 63 % of the capacitance at 100 A·g-1. Comparative data of SiOC-CDC beads and fibers show enhanced power handling for fiber mats only when the fiber network is intact, that is, a lowered performance was observed when using crushed mats that employ polymer binder.
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    Ultrathin gold nanowires for transparent electronics: breaking barriers
    (Amsterdam : Elsevier, 2016) Gonzalez-Garcia, Lola; Maurer, Johannes H.M.; Reiser, Beate; Kanelidis, Ioannis; Kraus, Tobias
    Novel types of Transparent Conductive Materials (TCMs) based on metal nanostructures are discussed. Dispersed metal nanoparticles can be deposited from liquids with moderate thermal budgets to form conductive films that are suitable for thin-film solar cells, displays, touch screens, and nanoelectronics. We aim at new TCMs that combine high electrical conductivity with optical transparency and mechanical flexibility. Wet-processed films of randomly arranged metallic nanowires networks are commercially established and provide a relatively cost-effective, scalable production. Ultrathin gold nanowires (AuNWs) with diameters below 2 nm and high aspect ratios have recently become available. They combine mechanical flexibility, high optical transparency, and chemical inertness. AuNWs carry oleylamine capping ligands from synthesis that cause high contact resistances at their junctions. We investigated different annealing processes based on temperature and plasma treatment, to remove the ligands after deposition and to allow electrical conductivity. Their effect on the resulting nanostructure and on the material properties was studied. Scanning Electron Microscopy (SEM) and optical spectroscopy revealed changes in the microstructure for the different post-treatments. We found that the conductivity and the stability of the TCM depended strongly on its final microstructure. We demonstrate that the best results are obtained using H2-plasma treatment.