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    An investigation on effectiveness of temperature treatment for fluorine-based reactive plasma jet machining of N-BK7®
    (Hoboken, NJ : Wiley Interscience, 2020) Kazemi, Faezeh; Boehm, Georg; Arnold, Thomas
    In this study, a fluorine-based reactive plasma jet is investigated as a promising tool for ultraprecise surface machining of N-BK7®. Plasma-generated particles react with an N-BK7 surface to create volatile and nonvolatile compounds. The desorption of volatile compounds results in an etched surface, whereas nonvolatile compounds form a residual layer in the etched area, causing unpredictable effects on the etching rate. Surface temperature treatment is proposed to improve the machining procedure with respect to deterministic material removal, leading to predictable results. It is shown that, at an elevated surface temperature, the residual layer properties are modified in favor of improved etching performance. The etching behavior of N-BK7 is compared with fused silica to verify the optimality of the obtained results.
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    A novel Deal–Grove-inspired model for fluorine-based plasma jet etching of borosilicate crown optical glass
    (Hoboken, NJ : Wiley Interscience, 2021) Kazemi, Faezeh; Boehm, Georg; Arnold, Thomas
    The Deal–Grove model is a state-of-the-art approach proposed for describing the thermal oxidation of silicon and the oxide thickness over time. In this study, the Deal–Grove concept provided the inspiration for a mathematical model for simulating plasma jet-based dry etching process of borosilicate crown glass (N-BK7®). The whole process is contained in two so-called Deal–Grove parameters, which are extracted from experimental data including local etching depth and surface temperature distribution. The proposed model is extended for the evolution of dynamic etch profiles, and the obtained results are validated experimentally. By establishing such a model, it is possible to predict the effect of the residual layer and surface temperature on the evolution of local etching depths over dwell time.