Search Results

Now showing 1 - 2 of 2
Loading...
Thumbnail Image
Item

Adhesion of a cylindrical punch with elastic properties that vary radially

2023, Kossa, Attila, Hensel, René, McMeeking, Robert M.

The adhesion of a rigid substrate and an adhered straight cylindrical punch with a non-homogeneous elastic modulus is analyzed. The stress distributions are obtained along the interface for various elastic modulus gradients. The calculations are performed in the commercial finite element software Abaqus using a user material (UMAT) subroutine to control the dependence of Young's modulus on the radial position. The UMAT code is shared in the paper. The results reveal that the decreasing elastic modulus toward the perimeter of the punch can be used to significantly reduce the normal stress magnitudes in the singularity domain, which leads to stronger adhesion. The increase in the adhesion strength is characterized numerically. The effect of Poisson's ratio is also analyzed.

Loading...
Thumbnail Image
Item

Tailored polyurethane acrylate blend for large-scale and high-performance micropatterned dry adhesives

2019, Yu, Dan, Hensel, René, Beckelmann, Dirk, Opsölder, Michael, Schäfer, Bruno, Moh, Karsten, de Oliveira, Peter William, Arzt, Eduard

Continuous roll-to-roll fabrication is essential for transferring the idea of bio-inspired, fibrillar dry adhesives into large-scale, synthetic, high-performance adhesive tapes. Toward this aim, we investigated process parameters that allow us to control the morphology and the resulting adhesion of mushroom-shaped micropatterned surfaces. Flexible silicone templates enabled the replication process of the polyurethane acrylate pre-polymer involving UV-light-induced cross-linking. For this paper, we particularly tailored the polyurethane acrylate pre-polymer by adding chemical components to tune UV curing kinetics and to reduce oxygen inhibition of radicals. We found that higher intensities of the UV light and faster reaction kinetics improved the quality of the microstructures, i.e., a larger cap diameter of the mushroom tips was achieved. The polymer blend U6E4 exhibited the fastest curing kinetics, which resulted in a micromorphology similar to that of the Ni-shim master structures. Best adhesion results were obtained for adhesive tapes made from U6E4 with 116 kPa pull-off stress, 1.4 N cm−1 peel strength and 71 kPa shear strength. In addition, repeated attachment–detachment tests over 100,000 cycles demonstrated strong robustness and reusability.