Filters

20213

More filters

20223
Reset filters

Settings

DDC: 530 × DDC: 540 × Type: article × Publisher: Amsterdam : Elsevier ×

Search Results

Now showing 1 - 3 of 3
  • Thumbnail Image
    Item
    Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma
    (Amsterdam : Elsevier, 2021) Heinke, Robert; Ehrhardt, Martin; Lorenz, Pierre; Zimmer, Klaus
    Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage. These processes, including reactive ion etching (RIE) and plasma etching (PE), are performed at vacuum conditions and provide high selectivity and vertical side wall etched patterns but create high costs and efforts in maintenance due to the required machinery. In contrast to electrically generated plasmas, laser-induced micro plasmas are controllable sources of reactive species in gases at atmospheric pressure that can be used for dry etching of materials. In the present study, we have demonstrated the laser-induced plasma etching of monocrystalline silicon. A Ti:Sapphire laser has been used for igniting an optically pumped plasma in a CF4/O2 gas mixture near atmospheric pressure. The influence of process parameters, like substrate temperature, O2 concentration, plasma-surface distance, etching duration, pulse energy and crystal orientation on etching rate and surface morphology has been investigated. Typical etching rates of 2–12 µm x min−1 can be achieved by varying mentioned parameters with a decreasing etching rate during the process. Different morphologies can be observed due to the parameters set, smooth as well as rough surfaces or even inverted pyramids. The presented etching method provides an approach for precise machining of silicon surfaces with good surface qualities near atmospheric pressure and sufficiently high material removal rates for ultraprecise surface machining. © 2021 The Author(s)
  • Thumbnail Image
    Item
    Revealing all states of dewetting of a thin gold layer on a silicon surface by nanosecond laser conditioning
    (Amsterdam : Elsevier, 2021) Ernst, Owen C.; Uebel, David; Kayser, Stefan; Lange, Felix; Teubner, Thomas; Boeck, Torsten
    Dewetting is a ubiquitous phenomenon which can be applied to the laser synthesis of nanoparticles. A classical spinodal dewetting process takes place in four successive states, which differ from each other in their morphology. In this study all states are revealed by interaction of pulsed nanosecond UV laser light with thin gold layers with thicknesses between 1 nm and 10 nm on (100) silicon wafers. The specific morphologies of the dewetting states are discussed with particular emphasis on the state boundaries. The main parameter determining which state is formed is not the duration for which the gold remains liquid, but rather the input energy provided by the laser. This shows that each state transition has a separate measurable activation energy. The temperature during the nanosecond pulses and the duration during which the gold remains liquid was determined by simulation using the COMSOL Multiphysics® software package. Using these calculations, an accurate local temperature profile and its development over time was simulated. An analytical study of the morphologies and formed structures was performed using Minkowski measures. With aid of this tool, the laser induced structures were compared with thermally annealed samples, with perfectly ordered structures and with perfectly random structures. The results show that both, structures of the laser induced and the annealed samples, strongly resemble the perfectly ordered structures. This reveals a close relationship between these structures and suggests that the phenomenon under investigation is indeed a spinodal dewetting generated by an internal material wave function. The purposeful generation of these structures and the elucidation of the underlying mechanism of dewetting by short pulse lasers may assist the realisation of various technical elements such as nanowires in science and industry. © 2020
  • Thumbnail Image
    Item
    On the viscous dissipation caused by randomly rough indenters in smooth sliding motion
    (Amsterdam : Elsevier, 2021) Sukhomlinov, Sergey; Müser, Martin H.
    The viscous dissipation between rigid, randomly rough indenters and linearly elastic counter bodies sliding past them is investigated using Green’s function molecular dynamics. The study encompasses a variety of models differing in the height spectra properties of the rigid indenter, in the viscoelasticity of the elastomer, and in their interaction. All systems reveal the expected damping linear in sliding velocity at small and a pronounced maximum at intermediate . Persson’s theory of rubber friction, which is adopted to the studied model systems, reflects all observed trends. However, close quantitative agreement is only found up to intermediate sliding velocities. Relative errors in the friction force become significant once the contact area is substantially reduced by sliding.