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    Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma
    (Amsterdam : Elsevier, 2021) Heinke, Robert; Ehrhardt, Martin; Lorenz, Pierre; Zimmer, Klaus
    Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage. These processes, including reactive ion etching (RIE) and plasma etching (PE), are performed at vacuum conditions and provide high selectivity and vertical side wall etched patterns but create high costs and efforts in maintenance due to the required machinery. In contrast to electrically generated plasmas, laser-induced micro plasmas are controllable sources of reactive species in gases at atmospheric pressure that can be used for dry etching of materials. In the present study, we have demonstrated the laser-induced plasma etching of monocrystalline silicon. A Ti:Sapphire laser has been used for igniting an optically pumped plasma in a CF4/O2 gas mixture near atmospheric pressure. The influence of process parameters, like substrate temperature, O2 concentration, plasma-surface distance, etching duration, pulse energy and crystal orientation on etching rate and surface morphology has been investigated. Typical etching rates of 2–12 µm x min−1 can be achieved by varying mentioned parameters with a decreasing etching rate during the process. Different morphologies can be observed due to the parameters set, smooth as well as rough surfaces or even inverted pyramids. The presented etching method provides an approach for precise machining of silicon surfaces with good surface qualities near atmospheric pressure and sufficiently high material removal rates for ultraprecise surface machining. © 2021 The Author(s)
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    On the viscous dissipation caused by randomly rough indenters in smooth sliding motion
    (Amsterdam : Elsevier, 2021) Sukhomlinov, Sergey; Müser, Martin H.
    The viscous dissipation between rigid, randomly rough indenters and linearly elastic counter bodies sliding past them is investigated using Green’s function molecular dynamics. The study encompasses a variety of models differing in the height spectra properties of the rigid indenter, in the viscoelasticity of the elastomer, and in their interaction. All systems reveal the expected damping linear in sliding velocity at small and a pronounced maximum at intermediate . Persson’s theory of rubber friction, which is adopted to the studied model systems, reflects all observed trends. However, close quantitative agreement is only found up to intermediate sliding velocities. Relative errors in the friction force become significant once the contact area is substantially reduced by sliding.