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DDC: 530 × Publisher: Weinheim : Wiley-VCH × WGL Institute: FBH × WGL Institute: IKZ ×

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Now showing 1 - 3 of 3
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    Current Status of Carbon‐Related Defect Luminescence in GaN
    (Weinheim : Wiley-VCH, 2021) Zimmermann, Friederike; Beyer, Jan; Röder, Christian; Beyer, Franziska C.; Richter, Eberhard; Irmscher, Klaus; Heitmann, Johannes
    Highly insulating layers are a prerequisite for gallium nitride (GaN)-based power electronic devices. For this purpose, carbon doping is one of the currently pursued approaches. However, its impact on the optical and electrical properties of GaN has been widely debated in the scientific community. For further improvement of device performance, a better understanding of the role of related defects is essential. To study optically active point defects, photoluminescence is one of the most frequently used experimental characterization techniques. Herein, the main recent advances in the attribution of carbon-related photoluminescence bands are reviewed, which were enabled by the interplay of a refinement of growth and characterization techniques and state-of-the-art first-principles calculations developed during the last decade. The predicted electronic structures of isolated carbon defects and selected carbon-impurity complexes are compared to experimental results. Taking into account both of these, a comprehensive overview on the present state of interpretation of carbon-related broad luminescence bands in bulk GaN is presented.
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    High-Temperature Annealing of AlGaN
    (Weinheim : Wiley-VCH, 2020) Hagedorn, Sylvia; Khan, Taimoor; Netzel, Carsten; Hartmann, Carsten; Walde, Sebastian; Weyers, Markus
    In the past few years, high-temperature annealing of AlN has become a proven method for providing AlN layers with low dislocation densities. Herein, the example of Al0.77Ga0.23N is used to investigate whether annealing can also improve the material quality of the ternary alloy. A detailed analysis of the influence of annealing temperature on structural and optical material properties is presented. It is found that with increasing annealing temperature, the threading dislocation density can be lowered from an initial value of 6.0 × 109 down to 2.6 × 109 cm−2. Ga depletion at the AlGaN surface and Ga diffusion into the AlN buffer layer are observed. After annealing, the defect luminescence between 3 and 4 eV is increased, accompanied by an increase in the oxygen concentration by about two orders of magnitude. Furthermore, due to annealing optical absorption at 325 nm (3.8 eV) occurs, which increases with increasing annealing temperature. It is assumed that the reason for this decrease in ultraviolet (UV) transmittance is the increasing number of vacancies caused by the removal of group-III and N atoms from the AlGaN lattice during annealing.
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    High‐Temperature Annealing and Patterned AlN/Sapphire Interfaces
    (Weinheim : Wiley-VCH, 2021) Hagedorn, Sylvia; Mogilatenko, Anna; Walde, Sebastian; Pacak, Daniel; Weinrich, Jonas; Hartmann, Carsten; Weyers, Markus
    Using the example of epitaxial lateral overgrowth of AlN on trench-patterned AlN/sapphire templates, the impact of introducing a high-temperature annealing step into the process chain is investigated. Covering the open surfaces of sapphire trench sidewalls with a thin layer of AlN is found to be necessary to preserve the trench shape during annealing. Both the influence of annealing temperature and annealing duration are investigated. To avoid the deformation of the AlN/sapphire interface during annealing, the annealing duration or annealing temperature must be low enough. Annealing for 1 h at 1730 °C is found to allow for the lowest threading dislocation density of 3.5 × 108 cm−2 in the subsequently grown AlN, while maintaining an uncracked smooth surface over the entire 2 in. wafer. Transmission electron microscopy study confirms the defect reduction by high-temperature annealing and reveals an additional strain relaxation mechanism by accumulation of horizontal dislocation lines at the interface between annealed and nonannealed AlN. By applying a second annealing step, the dislocation density can be further reduced to 2.5 × 108 cm−2.