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Now showing 1 - 4 of 4
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    Multiple lobes in the far-field distribution of terahertz quantum-cascade lasers due to self-interference
    (New York : American Institute of Physics, 2016) Röben, B.; Wienold, M.; Schrottke, L.; Grahn, H.T.
    The far-field distribution of the emission intensity of terahertz (THz) quantumcascade lasers (QCLs) frequently exhibits multiple lobes instead of a single-lobed Gaussian distribution. We show that such multiple lobes can result from selfinterference related to the typically large beam divergence of THz QCLs and the presence of an inevitable cryogenic operation environment including optical windows. We develop a quantitative model to reproduce the multiple lobes. We also demonstrate how a single-lobed far-field distribution can be achieved.
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    Spatially modulated broad-area lasers for narrow lateral far-field divergence
    (Washington, DC : Soc., 2021) Zeghuzi, Anissa; Koester, Jan-Philipp; Radziunas, Mindaugas; Christopher, Heike; Wenzel, Hans; Knigge, Andrea
    A novel laser design is presented that combines a longitudinal-lateral gain-loss modulation with an additional phase tailoring achieved by etching rectangular trenches. At 100 A pulsed operation, simulations predict a far-field profile with 0.3° full width at half maximum (ΘFWHM=0.3∘) where a 0.4°-wide main lobe contains 40% of the emitted optical output power (Θ40%=0.4∘). While far-field measurements of these structured lasers emitting 10 ns long pulses with 35 W peak power confirm a substantial enhancement of radiation within the central 1∘ angular range, the measured far-field intensity outside of the obtained central peak remains high.
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    Temperature-dependent Raman investigation of rolled up InGaAs/GaAs microtubes
    (New York, NY [u.a.] : Springer, 2012) Rodriguez, R.D.; Sheremet, E.; Thurmer, D.J.; Lehmann, D.; Gordan, O.D.; Seidel, F.; Milekhin, A.; Schmidt, O.G.; Hietschold, M.; Zahn, D.R.T.
    Large arrays of multifunctional rolled-up semiconductors can be mass-produced with precisely controlled size and composition, making them of great technological interest for micro- and nano-scale device fabrication. The microtube behavior at different temperatures is a key factor towards further engineering their functionality, as well as for characterizing strain, defects, and temperature-dependent properties of the structures. For this purpose, we probe optical phonons of GaAs/InGaAs rolled-up microtubes using Raman spectroscopy on defect-rich (faulty) and defect-free microtubes. The microtubes are fabricated by selectively etching an AlAs sacrificial layer in order to release the strained InGaAs/GaAs bilayer, all grown by molecular beam epitaxy. Pristine microtubes show homogeneity of the GaAs and InGaAs peak positions and intensities along the tube, which indicates a defect-free rolling up process, while for a cone-like microtube, a downward shift of the GaAs LO phonon peak along the cone is observed. Formation of other type of defects, including partially unfolded microtubes, can also be related to a high Raman intensity of the TO phonon in GaAs. We argue that the appearance of the TO phonon mode is a consequence of further relaxation of the selection rules due to the defects on the tubes, which makes this phonon useful for failure detection/prediction in such rolled up systems. In order to systematically characterize the temperature stability of the rolled up microtubes, Raman spectra were acquired as a function of sample temperature up to 300°C. The reversibility of the changes in the Raman spectra of the tubes within this temperature range is demonstrated.
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    Laser-induced reactive microplasma for etching of fused silica
    (Berlin ; Heidelberg ; New York : Springer, 2020) Ehrhardt, Martin; Lorenz, Pierre; Han, Bing; Zimmer, Klaus
    The ultra-precise machining (UPM) of surfaces with contact-free, beam-based technologies enables the development of flexible and reliable fabrication methods by non-vacuum processes for future application in advanced industrial fields. Laser machining by laser ablation features limitations for ultra-precise machining due to the depth precision, the surface morphology, and laser-induced defect formation. Contrary to physically-based etching, chemical-based dry and wet processing offer high quality, low damage material removal. In order to take advantage of both principles, a combined laser-plasma process is introduced. Ultra-short laser pulses are used to induce a free-standing microplasma in a CF4 gas atmosphere due to an optical breakdown. CF4 gas, with a pressure of 800–900 mbar, is ionized only near the focal point and reactive species are generated therein. Reactive species of the laser-induced microplasma can interact with the surface atoms of the target material forming volatile products. The release of these products is enhanced by the pulsed, laser-induced plasma resulting in material etching. In the present study, SiO2 surfaces were etched with reactive species of CF4 microplasma generated by their laser-induced break down with 775 nm pulses of an fs-laser (150 fs) at a repetition rate of 1 kHz. The dependency of the depth, the width, and the morphology of the etching pits were analysed systematically against the process parameters used. In particular, a linear increase of the etching depth up to 10 µm was achieved. The etched surface appears smooth without visible cracks, defects, or LIPSS (Laser-induced periodic surface structures). © 2020, The Author(s).