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    A Design Strategy for Mushroom-Shaped Microfibrils With Optimized Dry Adhesion: Experiments and Finite Element Analyses
    (New York, NY : ASME, 2021) Zhang, Xuan; Wang, Yue; Hensel, René; Arzt, Eduard
    Enhanced dry adhesion of micropatterned polymeric surfaces has been frequently demonstrated. Among the design parameters, the cap geometry plays an important role to improve their performance. In this study, we combined experiments on single polyurethane mushroom-shaped fibrils (with a stalk diameter of 80 µm and height of 125 µm) against flat glass, with numerical simulations implementing a cohesive zone. We found that the geometry of the mushroom cap strongly affects the interfacial crack behavior and the pull-off stress. The experimental and numerical results suggest that optimal adhesion was accompanied by the appearance of both edge and interior interfacial cracks during separation. Finite elemental analyses revealed the evolution of the interfacial stress distributions as a function of the cap thickness and confirmed the distinct detachment mechanisms. Furthermore, the effect of the stalk diameter and the Young's modulus on the adhesive force was established, resulting in an optimal design for mushroom-shaped fibrils.
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    Effect of Subsurface Microstructures on Adhesion of Highly Confined Elastic Films
    (New York, NY : ASME, 2021) Samri, Manar; Kossa, Attila; Hensel, René
    Polymer adhesive films sandwiched between two rigid solids are a common bonding strategy. The mechanics and consequently the adhesion of such geometrically confined films depend mainly on their thickness, Young's modulus, and the Poisson's ratio of the material. In this work, we explore the effect of a micropatterned subsurface embedded into the adhesive layer. We compare experiments with three-dimensional numerical simulations to evaluate the impact of the microstructure on the contact stiffness and effective modulus. The results are used to extend a previously proposed size scaling argument on adhesion from incompressible to slightly compressible films to account for the silicone used in our study with a Poisson's ratio of 0.495. In addition, interfacial stress distributions between the elastic film and the glass disc are obtained from plane strain simulations to evaluate characteristic adhesion failures such as edge cracks and cavitation. Overall, the micropatterned subsurface has a large impact on the contact stiffness, the interfacial stress distribution, and the detachment behavior; however, the adhesion performance is only slightly improved in comparison to a non-patterned subsurface.