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    Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives
    (Basel : MDPI, 2020) Lopes, Paulo E.; Moura, Duarte; Hilliou, Loic; Krause, Beate; Pötschke, Petra; Figueiredo, Hugo; Alves, Ricardo; Lepleux, Emmanuel; Pacheco, Louis; Paiva, Maria C.
    The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial ECAs are typically based on epoxy matrices with a high load (>60%) of silver particles, generally in the form of microflakes. The present work reports the production of ECAs based on epoxy/carbon nanomaterials using carbon nanotubes (single and multi-walled) and exfoliated graphite, as well as hybrid compositions, within a range of concentrations. The composites were tested for morphology (dispersion of the conductive nanomaterials), electrical and thermal conductivity, rheological characteristics and deposition on a test PCB. Finally, the ECA’s shelf life was assessed by mixing all the components and conductive nanomaterials, and evaluating the cure of the resin before and after freezing for a time range up to nine months. The ECAs produced could be stored at −18 °C without affecting the cure reaction.
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    Modelling and Experimental Investigation of Hexagonal Nacre-Like Structure Stiffness
    (Basel : MDPI, 2020) Rouhana, Rami; Stommel, Markus
    A highly ordered, hexagonal, nacre-like composite stiffness is investigated using experiments, simulations, and analytical models. Polystyrene and polyurethane are selected as materials for the manufactured specimens using laser cutting and hand lamination. A simulation geometry is made by digital microscope measurements of the specimens, and a simulation is conducted using material data based on component material characterization. Available analytical models are compared to the experimental results, and a more accurate model is derived specifically for highly ordered hexagonal tablets with relatively large in-plane gaps. The influence of hexagonal width, cut width, and interface thickness are analyzed using the hexagonal nacre-like composite stiffness model. The proposed analytical model converges within 1% with the simulation and experimental results