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- ItemA compact tube-in-tube microsized lithium-ion battery as an independent microelectric power supply unit([New York, NY] : Elsevier, 2021) Weng, Qunhong; Wang, Sitao; Liu, Lixiang; Lu, Xueyi; Zhu, Minshen; Li, Yang; Gabler, Felix; Schmidt, Oliver G.Independent and well-packaged miniaturized energy storage devices (MESDs) are indispensable as power sources or backup units for integrated circuits and many dispersive electronics applications. Challenges associated with MESD development relate to their low packaged areal energy density and poor battery performance. Here, we propose a compact tube-in-tube battery configuration to overcome the areal energy density and packaging problems in microbatteries. Compact microtubular microelectrodes rolled up from patterned nanomembranes are sealed in an inert glass capillary with a thin tube wall. The resultant tube-in-tube microsized lithium-ion batteries (micro-LIBs), based on various active materials, exhibit very high and scalable packaged areal energy densities up to 605 microampere hours per square centimeter (μAh cm−2) or 313 μWh cm−2 with footprints as small as 0.39–0.79 mm2. This approach is a practical alternative for microbattery microelectrode, packaging, and configuration innovations.
- ItemIcing mitigation by mems-fabricated surface dielectric barrier discharge(Basel : MDPI, 2021) Lindner, Matthias; Pipa, Andrei V.; Karpen, Norbert; Hink, Rüdiger; Berndt, Dominik; Foest, Rüdiger; Bonaccurso, Elmar; Weichwald, Robert; Friedberger, Alois; Caspari, Ralf; Brandenburg, Ronny; Schreiner, RupertAvoiding ice accumulation on aerodynamic components is of enormous importance to flight safety. Novel approaches utilizing surface dielectric barrier discharges (SDBDs) are expected to be more efficient and effective than conventional solutions for preventing ice accretion on aerodynamic components. In this work, the realization of SDBDs based on thin-film substrates by means of micro-electro-mechanical-systems (MEMS) technology is presented. The anti-icing performance of the MEMS SDBDs is presented and compared to SDBDs manufactured by printed circuit board (PCB) technology. It was observed that the 35 µm thick electrodes of the PCB SDBDs favor surface icing with an initial accumulation of supercooled water droplets at the electrode impact edges. This effect was not observed for 0.3 µm thick MEMS-fabricated electrodes indicating a clear advantage for MEMS-technology SDBDs for anti-icing applications. Titanium was identified as the most suitable material for MEMS electrodes. In addition, an optimization of the MEMS-SDBDs with respect to the dielectric materials as well as SDBD design is discussed.
- ItemAdaptive micro axicons for laser applications(Les Ulis : EDP Sciences, 2015) Wallrabe, Ulrike; Brunne, Jens; Treffer, Alexander; Grunwald, Ruediger; Bellouard, YvesWe report on the design, fabrication and testing of novel types of low-dispersion axicons for the adaptive shaping of ultrashort laser pulses. An overview is given on the basic geometries and operating principles of our purely reflective adaptive MEMS-type devices based on thermal or piezoelectric actuation. The flexible formation of nondiffracting beams at pulse durations down to a few oscillations of the optical field enables new applications in optical communication, pulse diagnostics, laser-matter interaction and particle manipulation. As an example, we show first promising results of adaptive autocorrelation. The combination of excellent pulse transfer, self-reconstruction properties and propagation invariance of nondiffracting beams with an adaptive approach promises to extend the field of practical applications significantly.
- ItemProlonged Corrosion Stability of a Microchip Sensor Implant during In Vivo Exposure(Basel : MDPI, 2018) Glogener, Paul; Krause, Michael; Katzer, Jens; Schubert, Markus A.; Birkholz, Mario; Bellmann, Olaf; Kröger-Koch, Claudia; Hammon, Harald M.; Metges, Cornelia C.; Welsch, Christine; Ruff, Roman; Hoffmann, Klaus P.A microelectronic biosensor was subjected to in vivo exposure by implanting it in the vicinity of m. trapezii (Trapezius muscle) from cattle. The implant is intended for the continuous monitoring of glucose levels, and the study aimed at evaluating the biostability of exposed semiconductor surfaces. The sensor chip was a microelectromechanical system (MEMS) prepared using 0.25 µm complementary metal–oxide–semiconductor CMOS/BiCMOS technology. Sensing is based on the principle of affinity viscometry with a sensoric assay, which is separated by a semipermeable membrane from the tissue. Outer dimensions of the otherwise hermetically sealed biosensor system were 39 × 49 × 16 mm. The test system was implanted into cattle in a subcutaneous position without running it. After 17 months, the device was explanted and analyzed by comparing it with unexposed chips and systems. Investigations focused on the MEMS chip using SEM, TEM, and elemental analysis by EDX mapping. The sensor chip turned out to be uncorroded and no diminishing of the topmost passivation layer could be determined, which contrasts remarkably with previous results on CMOS biosensors. The negligible corrosive attack is understood to be a side effect of the semipermeable membrane separating the assay from the tissue. It is concluded that the separation has enabled a prolonged biostability of the chip, which will be of relevance for biosensor implants in general.
- ItemMicro Fresnel mirror array with individual mirror control(Bristol : IOP Publ., 2020) Poyyathuruthy Bruno, Binal; Schütze, Robert; Grunwald, Ruediger; Wallrabe, UlrikeWe present the design and fabrication of a miniaturized array of piezoelectrically actuated high speed Fresnel mirrors with individual mirror control. These Fresnel mirrors can be used to generate propagation invariant and self-healing interference patterns. The mirrors are actuated using piezobimorph actuators, and the consequent change of the tilting angle of the mirrors changes the fringe spacing of the interference pattern generated. The array consists of four Fresnel mirrors each having an area of 2 × 2 mm2 arranged in a 2x2 configuration. The device, optimized using FEM simulations, is able to achieve maximum mirror deflections of 15 mrad, and has a resonance frequency of 28 kHz.
- ItemExperiments on MEMS Integration in 0.25 μm CMOS Process(Basel : MDPI, 2018) Michalik, Piotr; Fernández, Daniel; Wietstruck, Matthias; Kaynak, Mehmet; Madrenas, JordiIn this paper, we share our practical experience gained during the development of CMOS-MEMS (Complementary Metal-Oxide Semiconductor Micro Electro Mechanical Systems) devices in IHP SG25 technology. The experimental prototyping process is illustrated with examples of three CMOS-MEMS chips and starts from rough process exploration and characterization, followed by the definition of the useful MEMS design space to finally reach CMOS-MEMS devices with inertial mass up to 4.3 μg and resonance frequency down to 4.35 kHz. Furthermore, the presented design techniques help to avoid several structural and reliability issues such as layer delamination, device stiction, passivation fracture or device cracking due to stress.