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    Laser Patterning of CIGS thin Films with 1550 nm Nanosecond Laser Pulses
    (Amsterdam [u.a.] : Elsevier, 2016) Ehrhardt, Martin; Lorenz, Pierre; Bayer, Lukas; Zagoranskiy, Igor; Zimmer, Klaus
    The results of laser scribing experiments of CIGS thin films deposited on Mo-coated stainless steel sheets, using laser pulses with a wavelength of 1550 nm and a pulse duration of 6 ns, are presented in this study. It is shown that a removal of the CIGS from the Mo film is possible without edge melting of the CIGS or damaging of the Mo. The critical parameter for inducing the delamination lift-off process of the CIGS from the Mo was identified to be the scribing speed of the laser. In dependence on the laser parameters two different material removal processes were found. For a low pulse overlap the laser pulse penetrates the CIGS film and is absorbed in the interface between the CIGS and the Mo causing a lift-off process of the CIGS from the Mo back contact. For a high pulse overlap an ablation process starting from the top side of the CIGS film was found. The composition and morphology of the sample material after the laser patterning were analysed by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and micro-Raman spectroscopy.
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    Significance of the Resonance Condition for Controlling the Seam Position in Laser-assisted TIG Welding
    (Amsterdam [u.a.] : Elsevier, 2016) Emde, B.; Huse, M.; Hermsdorf, J.; Kaierle, S.; Wesling, V.; Overmeyer, L.; Kozakov, R.; Uhrlandt, D.
    As an energy-preserving variant of laser hybrid welding, laser-assisted arc welding uses laser powers of less than 1 kW. Recent studies have shown that the electrical conductivity of a TIG welding arc changes within the arc in case of a resonant interaction between laser radiation and argon atoms. This paper presents investigations on how to control the position of the arc root on the workpiece by means of the resonant interaction. Furthermore, the influence on the welding result is demonstrated. The welding tests were carried out on a cooled copper plate and steel samples with resonant and non-resonant laser radiation. Moreover, an analysis of the weld seam is presented.
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    Nanostructuring of Fused Silica Assisted by Laser-shaped Metal Triangles Using a Nanosecond Laser
    (Amsterdam [u.a.] : Elsevier, 2016) Lorenz, Pierre; GrĂ¼ner, Christoph; Ehrhardt, Martin; Bayer, Lukas; Zimmer, Klaus
    Self-organized processes are of special interest for the laser-induced nanostructuring of surfaces. In this study we combined two self-organized processes: the microsphere lithography and the molten phase transformation for the nanostructuring of dielectrics. A fused silica substrate was covered with periodically ordered polystyrene (PS) spheres and the system was subsequently covered with 30 nm chromium. Afterwards the PS spheres were removed and the bare and resultant periodic Cr triangles were irradiated in two steps using a KrF excimer laser. First step: A low laser fluence treatment results in a melting and shape transformation of the triangles. Second step: A high laser fluence treatment of the pre-treated surface results in a nanostructuring of the dielectric surface (and removal of the metal). The surface topography was studied by scanning electron microscopy. Furthermore, the different steps were simulated and compared with the experimental results.
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    Shock-wave-induced Thin-film Delamination (SWIFD): A Non-thermal Structuring Method of Functional Layers
    (Amsterdam [u.a.] : Elsevier, 2016) Lorenz, Pierre; Ehrhardt, Martin; Bayer, Lukas; Zimmer, Klaus
    The laser structuring of thermally sensitive functional layers is a challenge for laser methods. However, already ultrashort laser pulses can induce thermal modifications. The spatial separation of the laser pulse absorption from the functional layer removal process allows a non-thermal structuring process. Therefore, the rear side of the substrate is irradiated and the following laser ablation process induces a transverse shock wave through the substrate. Finally, the interaction of the shock wave with the substrate/functional layer interface results in a delamination of the functional layer. This shock-wave-induced thin-film delamination (SWIFD) method was tested on a layer system (1.5 μm thick epoxy-based negative photoresist SU 8, 250 nm–1 μm chromium layer) on a 25 μm polyimide flexible substrate where the influence of the systematic variation of the thickness of the metallic intermediate layer on the delamination process was studied. The resultant surface morphology was analyzed by optical microscopy as well as by white light interferometry (WLI).