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Publisher: Basel : MDPI × Subject: MEMS ×

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Now showing 1 - 3 of 3
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    Icing mitigation by mems-fabricated surface dielectric barrier discharge
    (Basel : MDPI, 2021) Lindner, Matthias; Pipa, Andrei V.; Karpen, Norbert; Hink, Rüdiger; Berndt, Dominik; Foest, Rüdiger; Bonaccurso, Elmar; Weichwald, Robert; Friedberger, Alois; Caspari, Ralf; Brandenburg, Ronny; Schreiner, Rupert
    Avoiding ice accumulation on aerodynamic components is of enormous importance to flight safety. Novel approaches utilizing surface dielectric barrier discharges (SDBDs) are expected to be more efficient and effective than conventional solutions for preventing ice accretion on aerodynamic components. In this work, the realization of SDBDs based on thin-film substrates by means of micro-electro-mechanical-systems (MEMS) technology is presented. The anti-icing performance of the MEMS SDBDs is presented and compared to SDBDs manufactured by printed circuit board (PCB) technology. It was observed that the 35 µm thick electrodes of the PCB SDBDs favor surface icing with an initial accumulation of supercooled water droplets at the electrode impact edges. This effect was not observed for 0.3 µm thick MEMS-fabricated electrodes indicating a clear advantage for MEMS-technology SDBDs for anti-icing applications. Titanium was identified as the most suitable material for MEMS electrodes. In addition, an optimization of the MEMS-SDBDs with respect to the dielectric materials as well as SDBD design is discussed.
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    Prolonged Corrosion Stability of a Microchip Sensor Implant during In Vivo Exposure
    (Basel : MDPI, 2018) Glogener, Paul; Krause, Michael; Katzer, Jens; Schubert, Markus A.; Birkholz, Mario; Bellmann, Olaf; Kröger-Koch, Claudia; Hammon, Harald M.; Metges, Cornelia C.; Welsch, Christine; Ruff, Roman; Hoffmann, Klaus P.
    A microelectronic biosensor was subjected to in vivo exposure by implanting it in the vicinity of m. trapezii (Trapezius muscle) from cattle. The implant is intended for the continuous monitoring of glucose levels, and the study aimed at evaluating the biostability of exposed semiconductor surfaces. The sensor chip was a microelectromechanical system (MEMS) prepared using 0.25 µm complementary metal–oxide–semiconductor CMOS/BiCMOS technology. Sensing is based on the principle of affinity viscometry with a sensoric assay, which is separated by a semipermeable membrane from the tissue. Outer dimensions of the otherwise hermetically sealed biosensor system were 39 × 49 × 16 mm. The test system was implanted into cattle in a subcutaneous position without running it. After 17 months, the device was explanted and analyzed by comparing it with unexposed chips and systems. Investigations focused on the MEMS chip using SEM, TEM, and elemental analysis by EDX mapping. The sensor chip turned out to be uncorroded and no diminishing of the topmost passivation layer could be determined, which contrasts remarkably with previous results on CMOS biosensors. The negligible corrosive attack is understood to be a side effect of the semipermeable membrane separating the assay from the tissue. It is concluded that the separation has enabled a prolonged biostability of the chip, which will be of relevance for biosensor implants in general.
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    Experiments on MEMS Integration in 0.25 μm CMOS Process
    (Basel : MDPI, 2018) Michalik, Piotr; Fernández, Daniel; Wietstruck, Matthias; Kaynak, Mehmet; Madrenas, Jordi
    In this paper, we share our practical experience gained during the development of CMOS-MEMS (Complementary Metal-Oxide Semiconductor Micro Electro Mechanical Systems) devices in IHP SG25 technology. The experimental prototyping process is illustrated with examples of three CMOS-MEMS chips and starts from rough process exploration and characterization, followed by the definition of the useful MEMS design space to finally reach CMOS-MEMS devices with inertial mass up to 4.3 μg and resonance frequency down to 4.35 kHz. Furthermore, the presented design techniques help to avoid several structural and reliability issues such as layer delamination, device stiction, passivation fracture or device cracking due to stress.