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Now showing 1 - 4 of 4
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    Heterobimetallic conducting polymers based on salophen complexes via electrosynthesis
    (London [u.a.] : RSC, 2023) Bia, Francesca; Gualandi, Isacco; Griebel, Jan; Rasmussen, Leon; Hallak, Bassam; Tonelli, Domenica; Kersting, Berthold
    In this work, we report the first electrochemical synthesis of two copolymeric bimetallic conducting polymers by a simple anodic electropolymerization method. The adopted precursors are electroactive transition metal (M = Ni, Cu and Fe) salophen complexes, which can be easily obtained by direct chemical synthesis. The resulting films, labeled poly-NiCu and poly-CuFe, were characterized by cyclic voltammetry in both organic and aqueous media, attenuated total reflectance Fourier transform infrared spectroscopy, UV-vis spectroscopy, scanning electron microscopy, and coupled energy dispersive X-ray spectroscopy. The films are conductive and exhibit great electrochemical stability in both organic and aqueous media (resistant over 100 cycles without significant loss in current response or changes in electrochemical behavior), which makes them good candidates for an array of potential applications. Electrochemical detection of ascorbic acid was performed using both materials.
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    Naphtalenediimide-based donor-acceptor copolymer prepared by chain-growth catalyst-transfer polycondensation: Evaluation of electron-transporting properties and application in printed polymer transistors
    (London [u.a.] : Royal Society of Chemistry, 2014) Schmidt, G.C.; Höft, D.; Haase, K.; Hübler, A.C.; Karpov, E.; Tkachov, R.; Stamm, M.; Kiriy, A.; Haidu, F.; Zahn, D.R.T.; Yan, H.; Facchetti, A.
    The semiconducting properties of a bithiophene-naphthalene diimide copolymer (PNDIT2) prepared by Ni-catalyzed chain-growth polycondensation (P1) and commercially available N2200 synthesized by Pd-catalyzed step-growth polycondensation were compared. Both polymers show similar electron mobility of ∼0.2 cm2 V-1 s-1, as measured in top-gate OFETs with Au source/drain electrodes. It is noteworthy that the new synthesis has several technological advantages compared to traditional Stille polycondensation, as it proceeds rapidly at room temperature and does not involve toxic tin-based monomers. Furthermore, a step forward to fully printed polymeric devices was achieved. To this end, transistors with PEDOT:PSS source/drain electrodes were fabricated on plastic foils by means of mass printing technologies in a roll-to-roll printing press. Surface treatment of the printed electrodes with PEIE, which reduces the work function of PEDOT:PSS, was essential to lower the threshold voltage and achieve high electron mobility. Fully polymeric P1 and N2200-based OFETs achieved average linear and saturation FET mobilities of >0.08 cm2 V-1 s-1. Hence, the performance of n-type, plastic OFET devices prepared in ambient laboratory conditions approaches those achieved by more sophisticated and expensive technologies, utilizing gold electrodes and time/energy consuming thermal annealing and lithographic steps.
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    Sacrificial ligand route to hybrid polythiophene-silver nanoparticles for sinter-free conductive inks
    (Cambridge : RSC, 2023) Drzic, Juraj; Escudero, Alberto; González-García, Lola; Kraus, Tobias
    We report the synthesis of AgNP@PEDOT:PSS hybrid conductive particles with silver cores and polythiophene shells that can be used to formulate sinter-free inks for printing electronics. First, Ag nanocrystals capped with the weakly bound ligand aminohexanoic acid (ϵ-Ahx) are prepared. The ligand shell is exchanged by reacting the dispersion with the polymer ionomer mixture poly(3,4-ethylene dioxythiophene):polystyrene sulfonate (PEDOT:PSS). The particles are characterized by electron microscopy, dynamic light scattering, Z potential, and Raman spectroscopy, confirming the replacement of the ligands on the metal particle surface. The resulting dispersion is colloidally stable as confirmed by DLS. Inks with a solid content of the hybrid particles of 300 mg mL−1 were prepared and deposited on different substrates. The new particles are components for hybrid inks that become electrically conductive without any chemical or thermal post-deposition treatment. We show that silver-based hybrid inks can be deposited on different substrates and possess an average conductivity after 24 h of drying at room temperature of 1.726 × 106 S m−1 ± 0.326 × 106 S m−1, only one order of magnitude lower than elemental silver and within the same order of magnitude as their gold ink counterpart.
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    Hybrid conductive filler/polycarbonate composites with enhanced electrical and thermal conductivities for bipolar plate applications
    (Manchester, NH : Wiley, 2019) Naji, Ahmed; Krause, Beate; Pötschke, Petra; Ameli, Amir
    Conductive polymer composites (CPCs) with high electrical and thermal conductivities are demanded for bipolar plates of fuel cells. In this work, CPCs of polycarbonate (PC) filled with carbon nanotube (CNT), carbon fiber (CF), graphite (G), and their double and triple hybrids were prepared using solution casting method followed by compression molding. The results showed that the electrical percolation thresholds for the PC-CNT and PC-CF were ~1 wt% and ~10 wt%, respectively, while no clear threshold was found for PC-G composites. Addition of 3–5 wt% CNT improved the electrical conductivity of PC-CF and PC-G systems up to 6 orders of magnitude and enhanced the thermal conductivity as much as 65%. The results of triple hybrid CPCs (with constant loading of 63 wt%) indicated that the combination of highest electrical and thermal conductivities is achieved when the CF and CNT loadings were near their percolation thresholds. Therefore, a triple filler system of 3 wt% CNT, 10 wt% CF, and 50 wt% G resulted in a composite with the through-plane and in-plane electrical conductivity, and thermal conductivity values of 12.8 S/cm, 8.3 S/cm, and 1.7 W/m•K, respectively. The results offer a combination of properties surpassing the existing values and suitable for high-conductivity applications such as bipolar plates. POLYM. COMPOS., 40:3189–3198, 2019. © 2018 Society of Plastics Engineers.