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    Roll-to-roll manufacturing of micropatterned adhesives by template compression
    (Basel : MDPI, 2018) Yu, D.; Beckelmann, D.; Opsölder, M.; Schäfer, B.; Moh, K.; Hensel, R.; de, Oliveira, P.; Arzt, E.
    For the next generation of handling systems, reversible adhesion enabled by micropatterned dry adhesives exhibits high potential. The versatility of polymeric micropatterns in handling objects made from various materials has been demonstrated by several groups. However, specimens reported in most studies have been restricted to the laboratory scale. Upscaling the size and quantity of micropatterned adhesives is the next step to enable successful technology transfer. Towards this aim, we introduce a continuous roll-to-roll replication process for fabrication of high-performance, mushroom-shaped micropatterned dry adhesives. The micropatterns were made from UV-curable polyurethane acrylates. To ensure the integrity of the complex structure during the fabrication process, flexible templates were used. The compression between the template and the wet prepolymer coating was investigated to optimize replication results without structural failures, and hence, to improve adhesion. As a result, we obtained micropatterned adhesive tapes, 10 cm in width and several meters in length, with adhesion strength about 250 kPa to glass, suitable for a wide range of applications. © 2018 by the authors.
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    Adhesion of a cylindrical punch with elastic properties that vary radially
    (Amsterdam [u.a.] : Elsevier, 2023) Kossa, Attila; Hensel, René; McMeeking, Robert M.
    The adhesion of a rigid substrate and an adhered straight cylindrical punch with a non-homogeneous elastic modulus is analyzed. The stress distributions are obtained along the interface for various elastic modulus gradients. The calculations are performed in the commercial finite element software Abaqus using a user material (UMAT) subroutine to control the dependence of Young's modulus on the radial position. The UMAT code is shared in the paper. The results reveal that the decreasing elastic modulus toward the perimeter of the punch can be used to significantly reduce the normal stress magnitudes in the singularity domain, which leads to stronger adhesion. The increase in the adhesion strength is characterized numerically. The effect of Poisson's ratio is also analyzed.