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- ItemSelf‐assembled on‐chip‐integrated giant magneto‐impedance sensorics(Hoboken, NJ : Wiley, 2015) Karnaushenko, Daniil; Karnaushenko, Dmitriy D.; Makarov, Denys; Baunack, Stefan; Schäfer, Rudolf; Schmidt, Oliver G.A novel method relying on strain engineering to realize arrays of on‐chip‐integrated giant magneto‐impedance (GMI) sensors equipped with pick‐up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.
- ItemActive Matrix Flexible Sensory Systems: Materials, Design, Fabrication, and Integration(Weinheim : Wiley-VCH Verlag GmbH & Co. KGaA, 2022) Bao, Bin; Karnaushenko, Dmitriy D.; Schmidt, Oliver G.; Song, Yanlin; Karnaushenko, DaniilA variety of modern applications including soft robotics, prosthetics, and health monitoring devices that cover electronic skins (e-skins), wearables as well as implants have been developed within the last two decades to bridge the gap between artificial and biological systems. During this development, high-density integration of various sensing modalities into flexible electronic devices becomes vitally important to improve the perception and interaction of the human bodies and robotic appliances with external environment. As a key component in flexible electronics, the flexible thin-film transistors (TFTs) have seen significant advances, allowing for building flexible active matrices. The flexible active matrices have been integrated with distributed arrays of sensing elements, enabling the detection of signals over a large area. The integration of sensors within pixels of flexible active matrices has brought the application scenarios to a higher level of sophistication with many advanced functionalities. Herein, recent progress in the active matrix flexible sensory systems is reviewed. The materials used to construct the semiconductor channels, the dielectric layers, and the flexible substrates for the active matrices are summarized. The pixel designs and fabrication strategies for the active matrix flexible sensory systems are briefly discussed. The applications of the flexible sensory systems are exemplified by reviewing pressure sensors, temperature sensors, photodetectors, magnetic sensors, and biosignal sensors. At the end, the recent development is summarized and the vision on the further advances of flexible active matrix sensory systems is provided.
- ItemHigh-performance magnetic sensorics for printable and flexible electronics(Hoboken, NJ : Wiley, 2014) Karnaushenko, Daniil; Makarov, Denys; Stöber, Max; Karnaushenko, Dmitriy D.; Baunack, Stefan; Schmidt, Oliver G.High‐performance giant magnetoresistive (GMR) sensorics are realized, which are printed at predefined locations on flexible circuitry. Remarkably, the printed magnetosensors remain fully operational over the complete consumer temperature range and reveal a giant magnetoresistance up to 37% and a sensitivity of 0.93 T−1 at 130 mT. With these specifications, printed magnetoelectronics can be controlled using flexible active electronics for the realization of smart packaging and energy‐efficient switches.
- ItemEntirely flexible on-site conditioned magnetic sensorics(Hoboken, NJ : Wiley, 2016) Münzenrieder, Niko; Karnaushenko, Daniil; Petti, Luisa; Cantarella, Giuseppe; Vogt, Christian; Büthe, Lars; Karnaushenko, Dmitriy D.; Schmidt, Oliver G.; Makarov, Denys; Tröster, GerhardThe first entirely flexible integrated magnetic field sensor system is realized consisting of a flexible giant magnetoresistive bridge on‐site conditioned using high‐performance IGZO‐based readout electronics. The system outperforms commercial fully integrated rigid magnetic sensors by at least one order of magnitude, whereas all components stay fully functional when bend to a radius of 5 mm.
- ItemFlexible Transparent Barrier Applications of Oxide Thin Films Prepared by Photochemical Conversion at Low Temperature and Ambient Pressure(Lausanne : Frontiers Media, 2020) With, Patrick C.; Helmstedt, Ulrike; Prager, LutzPhotoconversion of metal-organic precursors to thin film metal oxides using ultraviolet (UV) radiation in oxidative atmosphere is an attractive technology because it can be applied at temperatures <80°C and at ambient pressure. Thus, it enables preparing this class of thin films in a cost-efficient manner on temperature sensitive substrates such as polymer films. In this article, various aspects of research and development in the field of photochemical thin-film fabrication, with particular focus to the application of the produced films as gas permeation barriers for the encapsulation of optoelectronic devices are reviewed. Thereby, it covers investigations on fundamental photochemically initiated reactions for precursor classes containing metal-oxygen and metal-nitrogen bonds, and emphazises the relevance of that understanding for applicative considerations like integration of the single-layer barrier films into relevant encapsulation films. Further perspectives are given concerning integration of additional functionalities like electrical conductivity to the flexible and transparent barrier films. © Copyright © 2020 With, Helmstedt and Prager.
- ItemMechanical Robustness of Graphene on Flexible Transparent Substrates(Washington, DC : Soc., 2016) Kang, Moon H.; Prieto López, Lizbeth O.; Chen, Bingan; Teo, Ken; Williams, John A.; Milne, William I.; Cole, Matthew T.This study reports on a facile and widely applicable method of transferring chemical vapor deposited (CVD) graphene uniformly onto optically transparent and mechanically flexible substrates using commercially available, low-cost ultraviolet adhesive (UVA) and hot-press lamination (HPL). We report on the adhesion potential between the graphene and the substrate, and we compare these findings with those of the more commonly used cast polymer handler transfer processes. Graphene transferred with the two proposed methods showed lower surface energy and displayed a higher degree of adhesion (UVA: 4.40 ± 1.09 N/m, HPL: 0.60 ± 0.26 N/m) compared to equivalent CVD-graphene transferred using conventional poly(methyl methacrylate) (PMMA: 0.44 ± 0.06 N/m). The mechanical robustness of the transferred graphene was investigated by measuring the differential resistance as a function of bend angle and repeated bend–relax cycles across a range of bend radii. At a bend angle of 100° and a 2.5 mm bend radius, for both transfer techniques, the normalized resistance of graphene transferred on polyethylene terephthalate (PET) was around 80 times less than that of indium–tin oxide on PET. After 104 bend cycles, the resistance of the transferred graphene on PET using UVA and HPL was found to be, on average, around 25.5 and 8.1% higher than that of PMMA-transferred graphene, indicating that UVA- and HPL-transferred graphene are more strongly adhered compared to PMMA-transferred graphene. The robustness, in terms of maintained electrical performance upon mechanical fatigue, of the transferred graphene was around 60 times improved over ITO/PET upon many thousands of repeated bending stress cycles. On the basis of present production methods, the development of the next-generation of highly conformal, diverse form factor electronics, exploiting the emerging family of two-dimensional materials, necessitates the development of simple, low-cost, and mechanically robust transfer processes; the developed UVA and HPL approaches show significant potential and allow for large-area-compatible, near-room temperature transfer of graphene onto a diverse range of polymeric supports.
- ItemWearable magnetic field sensors for flexible electronics(Hoboken, NJ : Wiley, 2014) Melzer, Michael; Mönch, Jens Ingolf; Makarov, Denys; Zabila, Yevhen; Bermúdez, Gilbert Santiago Cañón; Karnaushenko, Daniil; Baunack, Stefan; Bahr, Falk; Yan, Chenglin; Kaltenbrunner, Martin; Schmidt, Oliver G.Highly flexible bismuth Hall sensors on polymeric foils are fabricated, and the key optimization steps that are required to boost their sensitivity to the bulk value are identified. The sensor can be bent around the wrist or positioned on the finger to realize an interactive pointing device for wearable electronics. Furthermore, this technology is of great interest for the rapidly developing market of eMobility, for optimization of eMotors and magnetic bearings.
- ItemFlexible MXene films for batteries and beyond(Hoboken, NJ : Wiley, 2022) Huang, Yang; Lu, Qiongqiong; Wu, Dianlun; Jiang, Yue; Liu, Zhenjie; Chen, Bin; Zhu, Minshen; Schmidt, Oliver G.MXenes add dozens of metallic conductors to the family of two-dimensional (2D) materials. A top-down synthesis approach removing A-layer atoms (e.g., Al, Si, and Ga) in MAX phases to produce 2D flakes attaches various surface terminations to MXenes. With these terminations, MXenes show tunable properties, promising a range of applications from energy storage devices to electronics, including sensors, transistors, and antennas. MXenes are also excellent building blocks to create flexible films used for flexible and wearable devices. This article summarizes the synthesis of MXene flakes and highlights aspects that need attention for flexible devices. Rather than listing the development of energy storage devices in detail, we focus on the main challenges of and solutions for constructing high-performance devices. Moreover, we show the applications of MXene films in electronics to call on designs to construct a complete system based on MXene with good flexibility, which consists of a power source, sensors, transistors, and wireless communications.
- ItemTemplated Self-Assembly of Ultrathin Gold Nanowires by Nanoimprinting for Transparent Flexible Electronics(Washington, DC : ACS Publications, 2016) Maurer, Johannes H. M.; González-García, Lola; Reiser, Beate; Kanelidis, Ioannis; Kraus, TobiasWe fabricated flexible, transparent, and conductive metal grids as transparent conductive materials (TCM) with adjustable properties by direct nanoimprinting of self-assembling colloidal metal nanowires. Ultrathin gold nanowires (diameter below 2 nm) with high mechanical flexibility were confined in a stamp and readily adapted to its features. During drying, the wires self-assembled into dense bundles that percolated throughout the stamp. The high aspect ratio and the bundling yielded continuous, hierarchical superstructures that connected the entire mesh even at low gold contents. A soft sintering step removed the ligand barriers but retained the imprinted structure. The material exhibited high conductivities (sheet resistances down to 29 Ω/sq) and transparencies that could be tuned by changing wire concentration and stamp geometry. We obtained TCMs that are suitable for applications such as touch screens. Mechanical bending tests showed a much higher bending resistance than commercial ITO: conductivity dropped by only 5.6% after 450 bending cycles at a bending radius of 5 mm.
- ItemBiomimetic microelectronics for regenerative neuronal cuff implants(Hoboken, NJ : Wiley, 2015) Karnaushenko, Daniil; Münzenrieder, Niko; Karnaushenko, Dmitriy D.; Koch, Britta; Meyer, Anne K.; Baunack, Stefan; Petti, Luisa; Tröster, Gerhard; Makarov, Denys; Schmidt, Oliver G.Smart biomimetics, a unique class of devices combining the mechanical adaptivity of soft actuators with the imperceptibility of microelectronics, is introduced. Due to their inherent ability to self‐assemble, biomimetic microelectronics can firmly yet gently attach to an inorganic or biological tissue enabling enclosure of, for example, nervous fibers, or guide the growth of neuronal cells during regeneration.