Normally-off GaN transistors for power applications

dc.bibliographicCitation.volume494
dc.contributor.authorHilt, O.
dc.contributor.authorBahat-Treidel, E.
dc.contributor.authorBrunner, F.
dc.contributor.authorKnauer, A.
dc.contributor.authorZhytnytska, R.
dc.contributor.authorKotara, P.
dc.contributor.authorWuerfl, J.
dc.date.available2019-06-28T12:40:15Z
dc.date.issued2014
dc.description.abstractNormally-off high voltage GaN-HFETs for switching applications are presented. Normally-off operation with threshold voltages of 1 V and more and with 5 V gate swing has been obtained by using p-type GaN as gate. Different GaN-based buffer types using doping and backside potential barriers have been used to obtain blocking strengths up to 1000 V. The increase of the dynamic on-state resistance is analyzed for the different buffer types. The best trade-off between low dispersion and high blocking strength was obtained for a modified carbon-doped GaN-buffer that showed a 2.6x increase of the dynamic on-state resistance for 500 V switching as compared to switching from 20 V off-state drain bias. Device operation up to 200 °C ambient temperature without any threshold voltage shift is demonstrated.eng
dc.description.versionpublishedVersioneng
dc.formatapplication/pdf
dc.identifier.urihttps://doi.org/10.34657/1591
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/4408
dc.language.isoengeng
dc.publisherMilton Park : Taylor & Franciseng
dc.relation.doihttps://doi.org/10.1088/1742-6596/494/1/012001
dc.relation.ispartofseriesJournal of Physics: Conference Series, Volume 494eng
dc.rights.licenseCC BY 3.0 Unportedeng
dc.rights.urihttps://creativecommons.org/licenses/by/3.0/eng
dc.subjectHeat problemseng
dc.subjectThermoanalysiseng
dc.subjectThreshold voltageeng
dc.subject.classificationKonferenzschriftger
dc.subject.ddc530eng
dc.titleNormally-off GaN transistors for power applicationseng
dc.typearticleeng
dc.typeTexteng
dcterms.bibliographicCitation.journalTitleJournal of Physics: Conference Serieseng
tib.accessRightsopenAccesseng
tib.relation.conferenceMicroTherm 2013 - Microtechnology and Thermal Problems in Electronics, Łódz, Poland, 25-28 June 2013eng
wgl.contributorFBHeng
wgl.subjectPhysikeng
wgl.typeKonferenzbeitrageng
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