Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling
dc.bibliographicCitation.firstPage | 3926 | eng |
dc.bibliographicCitation.issue | 18 | eng |
dc.bibliographicCitation.journalTitle | Materials | eng |
dc.bibliographicCitation.lastPage | 33 | eng |
dc.bibliographicCitation.volume | 13 | eng |
dc.contributor.author | Park, Eunmi | |
dc.contributor.author | Seifert, Marietta | |
dc.contributor.author | Rane, Gayatri K. | |
dc.contributor.author | Menzel, Siegfried B. | |
dc.contributor.author | Gemming, Thomas | |
dc.contributor.author | Nielsch, Kornelius | |
dc.date.accessioned | 2020-09-28T06:36:30Z | |
dc.date.available | 2020-09-28T06:36:30Z | |
dc.date.issued | 2020 | |
dc.description.abstract | The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO2 cover layer on thermally oxidized Si substrates. The samples were subjected to thermal cycling up to 900 °C in ultrahigh vacuum; meanwhile, the in-situ stress behavior was monitored by a laser based Multi-beam Optical Sensor (MOS) system. After preannealing at 900 °C for 24 h, the uncovered films showed a high residual stress at room temperature and a plastic behavior at high temperatures, while the covered Mo films showed an almost entirely elastic deformation during the thermal cycling between room temperature and 900 °C with hardly any plastic deformation, and a constant stress value during isothermal annealing without a notable creep. Furthermore, after thermal cycling, the Mo films without as well as with a cover layer showed low electrical resistivity (≤10 μΩ·cm). | eng |
dc.description.version | publishedVersion | eng |
dc.identifier.uri | https://doi.org/10.34657/4365 | |
dc.identifier.uri | https://oa.tib.eu/renate/handle/123456789/5736 | |
dc.language.iso | eng | eng |
dc.publisher | Basel : MDPI | eng |
dc.relation.doi | https://doi.org/10.3390/ma13183926 | |
dc.rights.license | CC BY 4.0 Unported | eng |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | eng |
dc.subject.ddc | 620 | eng |
dc.subject.other | molybdenum thin films | eng |
dc.subject.other | high-temperature behavior | eng |
dc.subject.other | intrinsic stress | eng |
dc.title | Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling | eng |
dc.type | Article | eng |
dc.type | Text | eng |
tib.accessRights | openAccess | eng |
wgl.contributor | IFWD | eng |
wgl.subject | Ingenieurwissenschaften | eng |
wgl.type | Zeitschriftenartikel | eng |
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