Rolled‐Up Self‐Assembly of Compact Magnetic Inductors, Transformers, and Resonators

Abstract

3D self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional 2D technologies. Among other microelectronic components, inductances, transformers, antennas, and resonators often rely on 3D configurations and interactions with electromagnetic fields requiring exponential fabrication efforts when downscaled to the micrometer range. Here, the controlled self-assembly of functional structures is demonstrated. By rolling up ultrathin films into cylindrically shaped microelectronic devices, electromagnetic resonators, inductive and mutually coupled coils are realized. Electrical performance of these devices is improved purely by transformation of a planar into a cylindrical geometry. This is accompanied by an overall downscaling of the device footprint area by more than 50 times. Application of compact self-assembled microstructures has significant impact on electronics, reducing size, fabrication efforts, and offering a wealth of new features in devices by 3D shaping.