Icing mitigation by mems-fabricated surface dielectric barrier discharge

dc.bibliographicCitation.firstPage11106
dc.bibliographicCitation.issue23
dc.bibliographicCitation.volume11
dc.contributor.authorLindner, Matthias
dc.contributor.authorPipa, Andrei V.
dc.contributor.authorKarpen, Norbert
dc.contributor.authorHink, Rüdiger
dc.contributor.authorBerndt, Dominik
dc.contributor.authorFoest, Rüdiger
dc.contributor.authorBonaccurso, Elmar
dc.contributor.authorWeichwald, Robert
dc.contributor.authorFriedberger, Alois
dc.contributor.authorCaspari, Ralf
dc.contributor.authorBrandenburg, Ronny
dc.contributor.authorSchreiner, Rupert
dc.date.accessioned2023-05-22T07:20:02Z
dc.date.available2023-05-22T07:20:02Z
dc.date.issued2021
dc.description.abstractAvoiding ice accumulation on aerodynamic components is of enormous importance to flight safety. Novel approaches utilizing surface dielectric barrier discharges (SDBDs) are expected to be more efficient and effective than conventional solutions for preventing ice accretion on aerodynamic components. In this work, the realization of SDBDs based on thin-film substrates by means of micro-electro-mechanical-systems (MEMS) technology is presented. The anti-icing performance of the MEMS SDBDs is presented and compared to SDBDs manufactured by printed circuit board (PCB) technology. It was observed that the 35 µm thick electrodes of the PCB SDBDs favor surface icing with an initial accumulation of supercooled water droplets at the electrode impact edges. This effect was not observed for 0.3 µm thick MEMS-fabricated electrodes indicating a clear advantage for MEMS-technology SDBDs for anti-icing applications. Titanium was identified as the most suitable material for MEMS electrodes. In addition, an optimization of the MEMS-SDBDs with respect to the dielectric materials as well as SDBD design is discussed.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/12158
dc.identifier.urihttp://dx.doi.org/10.34657/11191
dc.language.isoeng
dc.publisherBasel : MDPI
dc.relation.doihttps://doi.org/10.3390/app112311106
dc.relation.essn2076-3417
dc.relation.ispartofseriesApplied Sciences 11 (2021), Nr. 23eng
dc.rights.licenseCC BY 4.0 Unported
dc.rights.urihttps://creativecommons.org/licenses/by/4.0
dc.subjectAerospace engineeringeng
dc.subjectAnti-icingeng
dc.subjectLow-temperature plasmaeng
dc.subjectMEMSeng
dc.subjectSDBDeng
dc.subject.ddc600
dc.titleIcing mitigation by mems-fabricated surface dielectric barrier dischargeeng
dc.typearticle
dc.typeText
dcterms.bibliographicCitation.journalTitleApplied Sciences
tib.accessRightsopenAccess
wgl.contributorINP
wgl.subjectPhysikger
wgl.typeZeitschriftenartikelger
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