Experimental study of using micro-encapsulated phase-change material integrated into hemp shive wallboard

dc.bibliographicCitation.firstPage228eng
dc.bibliographicCitation.issue12eng
dc.bibliographicCitation.journalTitleBuildingseng
dc.bibliographicCitation.volume10eng
dc.contributor.authorKirilovs, Edgars
dc.contributor.authorZotova, Inga
dc.contributor.authorGendelis, Stanislavs
dc.contributor.authorJörg-Gusovius, Hans
dc.contributor.authorKukle, Silvija
dc.contributor.authorStramkale, Veneranda
dc.date.accessioned2021-07-22T06:48:41Z
dc.date.available2021-07-22T06:48:41Z
dc.date.issued2020
dc.description.abstractPhase change materials (PCMs) are now widely known as potential additives for building insulation materials to provide a thermal mass effect that helps conserve energy and maintain a comfortable indoor temperature. Therefore, the study presented in this paper focuses on an experimental investigation of the specific heat capacity and thermal conductivity of hemp shive mixed with PCMs. Industrially manufactured organic PCM-S50 received from MikroCaps Ltd. (Slovenia) has been used to further enhance respective properties of the product samples. The experimental boards were made from hemp shive by directly mixing 5% encapsulate PCMs into the mass. Cold pressing was used to manufacture the boards with Kleiberit urea formaldehyde resin glue as a binding agent. The experimental boards were made as 25 mm thick single-layer parts with a density of 300 ± 20 kg/m3, which qualify them as low-density boards. By adding nanocapsules during the board manufacturing process, the heat capacity is increased by 62%. Based on the great potential of using latent heat, it becomes a possible solution for the development of new technologies related to the automatic regulation of an indoor microclimate.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/6296
dc.identifier.urihttps://doi.org/10.34657/5343
dc.language.isoengeng
dc.publisherBasel : MDPI AGeng
dc.relation.doihttps://doi.org/10.3390/buildings10120228
dc.relation.essn2075-5309
dc.rights.licenseCC BY 4.0 Unportedeng
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/eng
dc.subject.ddc720eng
dc.subject.otherHemp shiveeng
dc.subject.otherLatent heateng
dc.subject.otherPhase change materialseng
dc.subject.otherPhase transition heateng
dc.subject.otherSpecific heat capacityeng
dc.titleExperimental study of using micro-encapsulated phase-change material integrated into hemp shive wallboardeng
dc.typeArticleeng
dc.typeTexteng
tib.accessRightsopenAccesseng
wgl.contributorATBeng
wgl.subjectIngenieurwissenschafteneng
wgl.typeZeitschriftenartikeleng
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