Secondary electron yield engineering of copper surfaces by 532 nm ultrashort laser pulses

Abstract

Nanostructured surfaces exhibit outstanding properties and enable manifold industrial applications. In this study the laser surface processing of polycrystalline, flat copper surfaces by 532 nm picosecond laser irradiation for secondary electron yield (SEY) reduction is reported. The laser beam was scanned in parallel lines across the sample surface in order to modify large surface areas. Morphology and SEY are characterized in dependence of the process parameters to derive correlations and mechanisms of the laser-based SEY engineering process. The nano- and microstructure morphology of the laser-modified surface was characterized by scanning electron microscopy and the secondary electron yield was measured. In general, an SEY reduction with increasing accumulated laser fluence was found. In particular, at low scanning speed (1 mm/s - 10 mm/s) and “high” laser power (~ 1 W) compact nanostructures with a very low SEY maximum of 0.7 are formed.