Strong Wet and Dry Adhesion by Cupped Microstructures

dc.bibliographicCitation.firstPage26483eng
dc.bibliographicCitation.journalTitleACS Applied Materials & Interfaceseng
dc.bibliographicCitation.lastPage8eng
dc.bibliographicCitation.volume11eng
dc.contributor.authorWang, Y.
dc.contributor.authorKang, V.
dc.contributor.authorArzt, E.
dc.contributor.authorFederle, W.
dc.contributor.authorHensel, R.
dc.date.accessioned2020-01-14T06:56:42Z
dc.date.available2020-01-14T06:56:42Z
dc.date.issued2019
dc.description.abstractRecent advances in bio-inspired microfibrillar adhesives have resulted in technologies that allow reliable attachment to a variety of surfaces. Because capillary and van der Waals forces are considerably weakened underwater, fibrillar adhesives are however far less effective in wet environments. Although various strategies have been proposed to achieve strong reversible underwater adhesion, strong adhesives that work both in air and underwater without additional surface treatments have yet to be developed. In this study, we report a novel design - cupped microstructures (CM) - that generates strong controllable adhesion in air and underwater. We measured the adhesive performance of cupped polyurethane microstructures with three different cup angles (15, 30, and 45°) and the same cup diameter of 100 μm in dry and wet conditions in comparison to standard mushroom-shaped microstructures (MSMs) of the same dimensions. In air, 15°CM performed comparably to the flat MSM of the same size with an adhesion strength (force per real contact area) of up to 1.3 MPa, but underwater, 15°CM achieved 20 times stronger adhesion than MSM (∼1 MPa versus ∼0.05 MPa). Furthermore, the cupped microstructures exhibit self-sealing properties, whereby stronger pulls lead to longer stable attachment and much higher adhesion through the formation of a better seal. © 2019 American Chemical Society.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://doi.org/10.34657/124
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/4853
dc.language.isoengeng
dc.publisherWashington, DC : American Chemical Societyeng
dc.relation.doihttps://doi.org/10.1021/acsami.9b07969
dc.rights.licenseCC BY-NC-ND 4.0 Unportedeng
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/eng
dc.subject.ddc620eng
dc.subject.othercupped microstructureseng
dc.subject.otherpolyurethaneeng
dc.subject.otherself-sealingeng
dc.subject.othertwo-photon lithographyeng
dc.subject.otherwet adhesioneng
dc.titleStrong Wet and Dry Adhesion by Cupped Microstructureseng
dc.typeArticleeng
dc.typeTexteng
tib.accessRightsopenAccesseng
wgl.contributorINMeng
wgl.subjectIngenieurwissenschafteneng
wgl.typeZeitschriftenartikeleng
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