Low-loss fiber-to-chip couplers with ultrawide optical bandwidth
dc.bibliographicCitation.firstPage | 10801 | eng |
dc.bibliographicCitation.issue | 1 | eng |
dc.bibliographicCitation.journalTitle | APL Photonics | eng |
dc.bibliographicCitation.volume | 4 | eng |
dc.contributor.author | Gehring, H. | |
dc.contributor.author | Blaicher, M. | |
dc.contributor.author | Hartmann, W. | |
dc.contributor.author | Varytis, P. | |
dc.contributor.author | Busch, K. | |
dc.contributor.author | Wegener, M. | |
dc.contributor.author | Pernice, W.H.P. | |
dc.date.accessioned | 2021-10-21T06:57:53Z | |
dc.date.available | 2021-10-21T06:57:53Z | |
dc.date.issued | 2019 | |
dc.description.abstract | Providing efficient access from optical fibers to on-chip photonic systems is a key challenge for integrated optics. In general, current solutions allow either narrowband out-of-plane-coupling to a large number of devices or broadband edge-coupling to a limited number of devices. Here we present a hybrid approach using 3D direct laser writing, merging the advantages of both concepts and enabling broadband and low-loss coupling to waveguide devices from the top. In the telecom wavelength regime, we demonstrate a coupling loss of less than -1.8 dB between 1480 nm and 1620 nm. In the wavelength range between 730 nm and 1700 nm, we achieve coupling efficiency well above -8 dB which is sufficient for a range of broadband applications spanning more than an octave. The 3D couplers allow relaxed mechanical alignment with respect to optical fibers, with -1 dB alignment tolerance of about 5 μm in x- and y-directions and -1 dB alignment tolerance in the z-direction of 34 μm. Using automatized alignment, many such couplers can be connected to integrated photonic circuits for rapid prototyping and hybrid integration. © 2019 Author(s). | eng |
dc.description.version | publishedVersion | eng |
dc.identifier.uri | https://oa.tib.eu/renate/handle/123456789/7076 | |
dc.identifier.uri | https://doi.org/10.34657/6123 | |
dc.language.iso | eng | eng |
dc.publisher | Melville, NY : AIP Publishing | eng |
dc.relation.doi | https://doi.org/10.1063/1.5064401 | |
dc.relation.essn | 2378-0967 | |
dc.rights.license | CC BY 4.0 Unported | eng |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | eng |
dc.subject.ddc | 530 | eng |
dc.subject.other | Fits and tolerances | eng |
dc.subject.other | Optical fibers | eng |
dc.subject.other | Alignment tolerance | eng |
dc.subject.other | Broadband applications | eng |
dc.subject.other | Coupling efficiency | eng |
dc.subject.other | Direct laser writing | eng |
dc.subject.other | Hybrid integration | eng |
dc.subject.other | Integrated photonic circuit | eng |
dc.subject.other | Mechanical alignment | eng |
dc.subject.other | Telecom wavelengths | eng |
dc.subject.other | Alignment | eng |
dc.title | Low-loss fiber-to-chip couplers with ultrawide optical bandwidth | eng |
dc.type | Article | eng |
dc.type | Text | eng |
tib.accessRights | openAccess | eng |
wgl.contributor | MBI | eng |
wgl.subject | Physik | eng |
wgl.type | Zeitschriftenartikel | eng |
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