Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications
dc.bibliographicCitation.firstPage | 2003252 | eng |
dc.bibliographicCitation.issue | 37 | eng |
dc.bibliographicCitation.volume | 32 | eng |
dc.contributor.author | Saggau, Christian N. | |
dc.contributor.author | Gabler, Felix | |
dc.contributor.author | Karnaushenko, Dmitriy D. | |
dc.contributor.author | Karnaushenko, Daniil | |
dc.contributor.author | Ma, Libo | |
dc.contributor.author | Schmidt, Oliver G. | |
dc.date.accessioned | 2021-08-19T09:49:23Z | |
dc.date.available | 2021-08-19T09:49:23Z | |
dc.date.issued | 2020 | |
dc.description.abstract | Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics. © 2020 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim | eng |
dc.description.version | publishedVersion | eng |
dc.identifier.uri | https://oa.tib.eu/renate/handle/123456789/6526 | |
dc.identifier.uri | https://doi.org/10.34657/5573 | |
dc.language.iso | eng | eng |
dc.publisher | Weinheim : Wiley-VCH | eng |
dc.relation.doi | https://doi.org/10.1002/adma.202003252 | |
dc.relation.essn | 1521-4095 | |
dc.relation.ispartofseries | Advanced Materials 32 (2020), Nr. 37 | eng |
dc.relation.issn | 0935-9648 | |
dc.rights.license | CC BY-NC 4.0 Unported | eng |
dc.rights.uri | https://creativecommons.org/licenses/by-nc/4.0/ | eng |
dc.subject | dry release | eng |
dc.subject | microcapacitors | eng |
dc.subject | roll-up | eng |
dc.subject | self-assembly | eng |
dc.subject | whispering gallery mode resonators | eng |
dc.subject.ddc | 540 | eng |
dc.subject.ddc | 660 | eng |
dc.title | Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications | eng |
dc.type | article | eng |
dc.type | Text | eng |
dcterms.bibliographicCitation.journalTitle | Advanced Materials | eng |
tib.accessRights | openAccess | eng |
wgl.contributor | IFWD | eng |
wgl.subject | Chemie | eng |
wgl.type | Zeitschriftenartikel | eng |
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