Laser-induced reactive microplasma for etching of fused silica
dc.bibliographicCitation.firstPage | 842 | eng |
dc.bibliographicCitation.issue | 11 | eng |
dc.bibliographicCitation.journalTitle | Applied Physics A: Materials Science and Processing | eng |
dc.bibliographicCitation.volume | 126 | eng |
dc.contributor.author | Ehrhardt, Martin | |
dc.contributor.author | Lorenz, Pierre | |
dc.contributor.author | Han, Bing | |
dc.contributor.author | Zimmer, Klaus | |
dc.date.accessioned | 2021-10-20T13:37:01Z | |
dc.date.available | 2021-10-20T13:37:01Z | |
dc.date.issued | 2020 | |
dc.description.abstract | The ultra-precise machining (UPM) of surfaces with contact-free, beam-based technologies enables the development of flexible and reliable fabrication methods by non-vacuum processes for future application in advanced industrial fields. Laser machining by laser ablation features limitations for ultra-precise machining due to the depth precision, the surface morphology, and laser-induced defect formation. Contrary to physically-based etching, chemical-based dry and wet processing offer high quality, low damage material removal. In order to take advantage of both principles, a combined laser-plasma process is introduced. Ultra-short laser pulses are used to induce a free-standing microplasma in a CF4 gas atmosphere due to an optical breakdown. CF4 gas, with a pressure of 800–900 mbar, is ionized only near the focal point and reactive species are generated therein. Reactive species of the laser-induced microplasma can interact with the surface atoms of the target material forming volatile products. The release of these products is enhanced by the pulsed, laser-induced plasma resulting in material etching. In the present study, SiO2 surfaces were etched with reactive species of CF4 microplasma generated by their laser-induced break down with 775 nm pulses of an fs-laser (150 fs) at a repetition rate of 1 kHz. The dependency of the depth, the width, and the morphology of the etching pits were analysed systematically against the process parameters used. In particular, a linear increase of the etching depth up to 10 µm was achieved. The etched surface appears smooth without visible cracks, defects, or LIPSS (Laser-induced periodic surface structures). © 2020, The Author(s). | eng |
dc.description.version | publishedVersion | eng |
dc.identifier.uri | https://oa.tib.eu/renate/handle/123456789/7073 | |
dc.identifier.uri | https://doi.org/10.34657/6120 | |
dc.language.iso | eng | eng |
dc.publisher | Berlin ; Heidelberg ; New York : Springer | eng |
dc.relation.doi | https://doi.org/10.1007/s00339-020-04019-x | |
dc.relation.essn | 1432-0630 | |
dc.rights.license | CC BY 4.0 Unported | eng |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | eng |
dc.subject.ddc | 530 | eng |
dc.subject.other | Etching | eng |
dc.subject.other | Fluorine-containing gas | eng |
dc.subject.other | Fused silica | eng |
dc.subject.other | Laser | eng |
dc.subject.other | Optical breakdown | eng |
dc.subject.other | Plasma formation | eng |
dc.title | Laser-induced reactive microplasma for etching of fused silica | eng |
dc.type | Article | eng |
dc.type | Text | eng |
tib.accessRights | openAccess | eng |
wgl.contributor | IOM | eng |
wgl.subject | Physik | eng |
wgl.type | Zeitschriftenartikel | eng |
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