Realisierung vertrauenswürdiger komplexer Systeme durch Wafer-Level Packaging (REWAL)
Abschlussbericht
| dc.contributor.author | Elger, Gordon | |
| dc.date.accessioned | 2026-05-15T16:44:52Z | |
| dc.date.available | 2026-05-15T16:44:52Z | |
| dc.date.issued | 2025 | |
| dc.description.abstract | [no abstract available] | ger |
| dc.description.version | publishedVersion | |
| dc.identifier.uri | https://oa.tib.eu/renate/handle/123456789/36701 | |
| dc.identifier.uri | https://doi.org/10.34657/35769 | |
| dc.language.iso | ger | |
| dc.publisher | Hannover : Technische Informationsbibliothek | |
| dc.relation.affiliation | Technische Hochschule Ingolstadt, Forschungsförderung, -transfer & -controlling (FORTEC) | |
| dc.rights.license | Creative Commons Attribution-NonDerivs 3.0 Germany | |
| dc.subject.ddc | 000 | Informatik, Information und Wissen, allgemeine Werke | |
| dc.title | Realisierung vertrauenswürdiger komplexer Systeme durch Wafer-Level Packaging (REWAL) | ger |
| dc.title.subtitle | Abschlussbericht | |
| dc.type | Report | |
| dcterms.event.date | 01.05.2021 bis 31.10.2024 | |
| dcterms.extent | 23 Seiten | |
| dtf.funding.funder | BMFTR | |
| dtf.funding.program | 16ME0312 | |
| dtf.funding.verbundnummer | 01230721 | |
| tib.accessRights | openAccess |
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