Thin film deposition using energetic ions

dc.bibliographicCitation.firstPage4109eng
dc.bibliographicCitation.issue8eng
dc.bibliographicCitation.journalTitleMaterialseng
dc.bibliographicCitation.volume3eng
dc.contributor.authorManova, D.
dc.contributor.authorGerlach, J.W.
dc.contributor.authorMändl, S.
dc.date.accessioned2020-08-12T05:34:49Z
dc.date.available2020-08-12T05:34:49Z
dc.date.issued2010
dc.description.abstractOne important recent trend in deposition technology is the continuous expansion of available processes towards higher ion assistance with the subsequent beneficial effects to film properties. Nowadays, a multitude of processes, including laser ablation and deposition, vacuum arc deposition, ion assisted deposition, high power impulse magnetron sputtering and plasma immersion ion implantation, are available. However, there are obstacles to overcome in all technologies, including line-of-sight processes, particle contaminations and low growth rates, which lead to ongoing process refinements and development of new methods. Concerning the deposited thin films, control of energetic ion bombardment leads to improved adhesion, reduced substrate temperatures, control of intrinsic stress within the films as well as adjustment of surface texture, phase formation and nanotopography. This review illustrates recent trends for both areas; plasma process and solid state surface processes. © 2010 by the authors.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://doi.org/10.34657/4107
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/5478
dc.language.isoengeng
dc.publisherBasel : MDPIeng
dc.relation.doihttps://doi.org/10.3390/ma3084109
dc.relation.issn1996-1944
dc.rights.licenseCC BY 3.0 Unportedeng
dc.rights.urihttps://creativecommons.org/licenses/by/3.0/eng
dc.subject.ddc620eng
dc.subject.otherIon assisted depositioneng
dc.subject.otherIon implantationeng
dc.subject.otherNanostructureseng
dc.subject.otherPVDeng
dc.subject.otherThin filmseng
dc.subject.otherDeposition technologyeng
dc.subject.otherHigh power impulse magnetron sputtering (HIPIMS)eng
dc.subject.otherIon Assisted Depositioneng
dc.subject.otherParticle contaminationeng
dc.subject.otherPlasma immersion ion implantationeng
dc.subject.otherSubstrate temperatureeng
dc.subject.otherThin-film depositionseng
dc.subject.otherVacuum arc depositioneng
dc.subject.otherIon bombardmenteng
dc.subject.otherIon implantationeng
dc.subject.otherNanostructureseng
dc.subject.otherPhysical vapor depositioneng
dc.subject.otherPlasma applicationseng
dc.subject.otherThin filmseng
dc.subject.otherVacuum applicationseng
dc.subject.otherDepositioneng
dc.titleThin film deposition using energetic ionseng
dc.typeArticleeng
dc.typeTexteng
tib.accessRightsopenAccesseng
wgl.contributorIOMeng
wgl.subjectIngenieurwissenschafteneng
wgl.typeZeitschriftenartikeleng
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