Mouldable all-carbon integrated circuits

dc.bibliographicCitation.articleNumber2302
dc.bibliographicCitation.firstPage2302
dc.bibliographicCitation.issue1
dc.bibliographicCitation.journalTitleNature Communications
dc.bibliographicCitation.volume4
dc.contributor.authorSun, Dong-Ming
dc.contributor.authorTimmermans, Marina Y.
dc.contributor.authorKaskela, Antti
dc.contributor.authorNasibulin, Albert G.
dc.contributor.authorKishimoto, Shigeru
dc.contributor.authorMizutani, Takashi
dc.contributor.authorKauppinen, Esko I.
dc.contributor.authorOhno, Yutaka
dc.date.accessioned2025-03-03T12:23:10Z
dc.date.available2025-03-03T12:23:10Z
dc.date.issued2013
dc.description.abstractA variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm 2 V -1 s -1 and an ON/OFF ratio of 10 5. The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability. © 2013 Macmillan Publishers Limited.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/18722
dc.identifier.urihttps://doi.org/10.34657/17741
dc.language.isoeng
dc.publisher[London] : Springer Nature
dc.relation.doihttps://doi.org/10.1038/ncomms3302
dc.relation.essn2041-1723
dc.rights.licenseCC BY-NC-SA 3.0 Unported
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/3.0/
dc.subject.ddc500
dc.subject.othercarboneng
dc.subject.otherplasticeng
dc.subject.othercarboneng
dc.subject.otherelectronic equipmenteng
dc.subject.othermobilityeng
dc.subject.otherplasticeng
dc.subject.othersubstrateeng
dc.subject.otherarticleeng
dc.subject.otherelectronicseng
dc.subject.otherintegrated circuiteng
dc.subject.othernanodeviceeng
dc.subject.otheroscillationeng
dc.subject.otheroscillatoreng
dc.titleMouldable all-carbon integrated circuitseng
dc.typeArticle
dc.typeText
tib.accessRightsopenAccess
wgl.contributorINP
wgl.subjectPhysikger
wgl.typeZeitschriftenartikelger
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