Laser structuring of thin layers for flexible electronics by a shock wave-induced delamination process

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Date
2014
Volume
56
Issue
C
Journal Title
Title
Series Titel
Publisher
Amsterdam [u.a.] : Elsevier
Abstract

The defect-free laser-assisted structuring of thin films on flexible substrates is a challenge for laser methods. However, solving this problem exhibits an outstanding potential for a pioneering development of flexible electronics. Thereby, the laser-assisted delamination method has a great application potential. At the delamination process: the localized removal of the layer is induced by a shock wave which is produced by a laser ablation process on the rear side of the substrate. In this study, the thin-film patterning process is investigated for different polymer substrates dependent on the material and laser parameters using a KrF excimer laser. The resultant structures were studied by optical microscopy and white light interferometry (WLI). The delamination process was tested at different samples (indium tin oxide (ITO) on polyethylene terephthalate (PET), epoxy-based negative photoresist (SU8) on polyimide (PI) and indium tin oxide/copper indium gallium selenide/molybdenum (ITO/CIGS/Mo) on PI.

Description
Keywords
Flexible substrate, Laser structuring, Laser-induced delamination process, Thin layer etching
Citation
Lorenz, P., Ehrhardt, M., & Zimmer, K. (2014). Laser structuring of thin layers for flexible electronics by a shock wave-induced delamination process. 56(C). https://doi.org//10.1016/j.phpro.2014.08.013
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License
CC BY-NC-ND 3.0 Unported