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    A Patternable and In Situ Formed Polymeric Zinc Blanket for a Reversible Zinc Anode in a Skin-Mountable Microbattery
    (Weinheim : Wiley-VCH, 2021) Zhu, Minshen; Hu, Junping; Lu, Qiongqiong; Dong, Haiyun; Karnaushenko, Dmitriy D.; Becker, Christian; Karnaushenko, Daniil; Li, Yang; Tang, Hongmei; Qu, Zhe; Ge, Jin; Schmidt, Oliver G.
    Owing to their high safety and reversibility, aqueous microbatteries using zinc anodes and an acid electrolyte have emerged as promising candidates for wearable electronics. However, a critical limitation that prevents implementing zinc chemistry at the microscale lies in its spontaneous corrosion in an acidic electrolyte that causes a capacity loss of 40% after a ten-hour rest. Widespread anti-corrosion techniques, such as polymer coating, often retard the kinetics of zinc plating/stripping and lack spatial control at the microscale. Here, a polyimide coating that resolves this dilemma is reported. The coating prevents corrosion and hence reduces the capacity loss of a standby microbattery to 10%. The coordination of carbonyl oxygen in the polyimide with zinc ions builds up over cycling, creating a zinc blanket that minimizes the concentration gradient through the electrode/electrolyte interface and thus allows for fast kinetics and low plating/stripping overpotential. The polyimide's patternable feature energizes microbatteries in both aqueous and hydrogel electrolytes, delivering a supercapacitor-level rate performance and 400 stable cycles in the hydrogel electrolyte. Moreover, the microbattery is able to be attached to human skin and offers strong resistance to deformations, splashing, and external shock. The skin-mountable microbattery demonstrates an excellent combination of anti-corrosion, reversibility, and durability in wearables. © 2021 The Authors. Advanced Materials published by Wiley-VCH GmbH
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    Digital Electrochemistry for On-Chip Heterogeneous Material Integration
    (Weinheim : Wiley-VCH, 2021) Bao, Bin; Rivkin, Boris; Akbar, Farzin; Karnaushenko, Dmitriy D.; Bandari, Vineeth Kumar; Teuerle, Laura; Becker, Christian; Baunack, Stefan; Karnaushenko, Daniil; Schmidt, Oliver G.
    Many modern electronic applications rely on functional units arranged in an active-matrix integrated on a single chip. The active-matrix allows numerous identical device pixels to be addressed within a single system. However, next-generation electronics requires heterogeneous integration of dissimilar devices, where sensors, actuators, and display pixels sense and interact with the local environment. Heterogeneous material integration allows the reduction of size, increase of functionality, and enhancement of performance; however, it is challenging since front-end fabrication technologies in microelectronics put extremely high demands on materials, fabrication protocols, and processing environments. To overcome the obstacle in heterogeneous material integration, digital electrochemistry is explored here, which site-selectively carries out electrochemical processes to deposit and address electroactive materials within the pixel array. More specifically, an amorphous indium-gallium-zinc oxide (a-IGZO) thin-film-transistor (TFT) active-matrix is used to address pixels within the matrix and locally control electrochemical reactions for material growth and actuation. The digital electrochemistry procedure is studied in-depth by using polypyrrole (PPy) as a model material. Active-matrix-driven multicolored electrochromic patterns and actuator arrays are fabricated to demonstrate the capabilities of this approach for material integration. The approach can be extended to a broad range of materials and structures, opening up a new path for advanced heterogeneous microsystem integration.
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    Active Matrix Flexible Sensory Systems: Materials, Design, Fabrication, and Integration
    (Weinheim : Wiley-VCH Verlag GmbH & Co. KGaA, 2022) Bao, Bin; Karnaushenko, Dmitriy D.; Schmidt, Oliver G.; Song, Yanlin; Karnaushenko, Daniil
    A variety of modern applications including soft robotics, prosthetics, and health monitoring devices that cover electronic skins (e-skins), wearables as well as implants have been developed within the last two decades to bridge the gap between artificial and biological systems. During this development, high-density integration of various sensing modalities into flexible electronic devices becomes vitally important to improve the perception and interaction of the human bodies and robotic appliances with external environment. As a key component in flexible electronics, the flexible thin-film transistors (TFTs) have seen significant advances, allowing for building flexible active matrices. The flexible active matrices have been integrated with distributed arrays of sensing elements, enabling the detection of signals over a large area. The integration of sensors within pixels of flexible active matrices has brought the application scenarios to a higher level of sophistication with many advanced functionalities. Herein, recent progress in the active matrix flexible sensory systems is reviewed. The materials used to construct the semiconductor channels, the dielectric layers, and the flexible substrates for the active matrices are summarized. The pixel designs and fabrication strategies for the active matrix flexible sensory systems are briefly discussed. The applications of the flexible sensory systems are exemplified by reviewing pressure sensors, temperature sensors, photodetectors, magnetic sensors, and biosignal sensors. At the end, the recent development is summarized and the vision on the further advances of flexible active matrix sensory systems is provided.
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    Mechanical Characterization of Compact Rolled-up Microtubes Using In Situ Scanning Electron Microscopy Nanoindentation and Finite Element Analysis
    (Weinheim : Wiley-VCH, 2021) Moradi, Somayeh; Jöhrmann, Nathanael; Karnaushenko, Dmitriy D.; Zschenderlein, Uwe; Karnaushenko, Daniil; Wunderle, Bernhard; Schmidt, Oliver G.
    Self-assembled Swiss-roll microstructures (SRMs) are widely explored to build up microelectronic devices such as capacitors, transistors, or inductors as well as sensors and lab-in-a-tube systems. These devices often need to be transferred to a special position on a microchip or printed circuit board for the final application. Such a device transfer is typically conducted by a pick-and-place process exerting enormous mechanical loads onto the 3D components that may cause catastrophic failure of the device. Herein, the mechanical deformation behavior of SRMs using experiments and simulations is investigated. SRMs using in situ scanning electron microscopy (SEM) combined with nanoindentation are characterized. This allows us to mimic and characterize mechanical loads as they occur in a pick-and-place process. The deformation response of SRMs depends on three geometrical factors, i.e., the number of windings, compactness of consecutive windings, and inner diameter of the microtube. Nonlinear finite element analysis (FEA) showing good agreement with experiments is performed. It is believed that the insights into the mechanical loading of 3D self-assembled architectures will lead to novel techniques suitable for a new generation of pick-and-place machines operating at the microscale. © 2021 The Authors. Advanced Engineering Materials published by Wiley-VCH GmbH
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    A new dimension for magnetosensitive e-skins: active matrix integrated micro-origami sensor arrays
    ([London] : Nature Publishing Group UK, 2022) Becker, Christian; Bao, Bin; Karnaushenko, Dmitriy D.; Bandari, Vineeth Kumar; Rivkin, Boris; Li, Zhe; Faghih, Maryam; Karnaushenko, Daniil; Schmidt, Oliver G.
    Magnetic sensors are widely used in our daily life for assessing the position and orientation of objects. Recently, the magnetic sensing modality has been introduced to electronic skins (e-skins), enabling remote perception of moving objects. However, the integration density of magnetic sensors is limited and the vector properties of the magnetic field cannot be fully explored since the sensors can only perceive field components in one or two dimensions. Here, we report an approach to fabricate high-density integrated active matrix magnetic sensor with three-dimensional (3D) magnetic vector field sensing capability. The 3D magnetic sensor is composed of an array of self-assembled micro-origami cubic architectures with biased anisotropic magnetoresistance (AMR) sensors manufactured in a wafer-scale process. Integrating the 3D magnetic sensors into an e-skin with embedded magnetic hairs enables real-time multidirectional tactile perception. We demonstrate a versatile approach for the fabrication of active matrix integrated 3D sensor arrays using micro-origami and pave the way for new electronic devices relying on the autonomous rearrangement of functional elements in space.
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    Nano-biosupercapacitors enable autarkic sensor operation in blood
    ([London] : Nature Publishing Group UK, 2021) Lee, Yeji; Bandari, Vineeth Kumar; Li, Zhe; Medina-Sánchez, Mariana; Maitz, Manfred F.; Karnaushenko, Daniil; Tsurkan, Mikhail V; Karnaushenko, Dmitriy D.; Schmidt, Oliver G.
    Today’s smallest energy storage devices for in-vivo applications are larger than 3 mm3 and lack the ability to continuously drive the complex functions of smart dust electronic and microrobotic systems. Here, we create a tubular biosupercapacitor occupying a mere volume of 1/1000 mm3 (=1 nanoliter), yet delivering up to 1.6 V in blood. The tubular geometry of this nano-biosupercapacitor provides efficient self-protection against external forces from pulsating blood or muscle contraction. Redox enzymes and living cells, naturally present in blood boost the performance of the device by 40% and help to solve the self-discharging problem persistently encountered by miniaturized supercapacitors. At full capacity, the nano-biosupercapacitors drive a complex integrated sensor system to measure the pH-value in blood. This demonstration opens up opportunities for next generation intravascular implants and microrobotic systems operating in hard-to-reach small spaces deep inside the human body.
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    Direct imaging of nanoscale field-driven domain wall oscillations in Landau structures
    (Cambridge : RSC Publ., 2022) Singh, Balram; Ravishankar, Rachappa; Otálora, Jorge A.; Soldatov, Ivan; Schäfer, Rudolf; Karnaushenko, Daniil; Neu, Volker; Schmidt, Oliver G.
    Linear oscillatory motion of domain walls (DWs) in the kHz and MHz regime is crucial when realizing precise magnetic field sensors such as giant magnetoimpedance devices. Numerous magnetically active defects lead to pinning of the DWs during their motion, affecting the overall behavior. Thus, the direct monitoring of the domain wall's oscillatory behavior is an important step to comprehend the underlying micromagnetic processes and to improve the magnetoresistive performance of these devices. Here, we report an imaging approach to investigate such DW dynamics with nanoscale spatial resolution employing conventional table-top microscopy techniques. Time-averaged magnetic force microscopy and Kerr imaging methods are applied to quantify the DW oscillations in Ni81Fe19 rectangular structures with Landau domain configuration and are complemented by numeric micromagnetic simulations. We study the oscillation amplitude as a function of external magnetic field strength, frequency, magnetic structure size, thickness and anisotropy and understand the excited DW behavior as a forced damped harmonic oscillator with restoring force being influenced by the geometry, thickness, and anisotropy of the Ni81Fe19 structure. This approach offers new possibilities for the analysis of DW motion at elevated frequencies and at a spatial resolution of well below 100 nm in various branches of nanomagnetism.
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    Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications
    (Weinheim : Wiley-VCH, 2020) Saggau, Christian N.; Gabler, Felix; Karnaushenko, Dmitriy D.; Karnaushenko, Daniil; Ma, Libo; Schmidt, Oliver G.
    Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics. © 2020 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
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    Shape-Controlled Flexible Microelectronics Facilitated by Integrated Sensors and Conductive Polymer Actuators
    (Weinheim : Wiley-VCH Verlag GmbH & Co. KGaA, 2021) Rivkin, Boris; Becker, Christian; Akbar, Farzin; Ravishankar, Rachappa; Karnaushenko, Dmitriy; Naumann, Ronald; Mirhajivarzaneh, Aaleh; Medina-Sánchez, Mariana; Karnaushenko, Daniil; Schmidt, Oliver G.
    The next generation of biomedical tools requires reshapeable electronics to closely interface with biological tissues. This will offer unique mechanical properties and the ability to conform to irregular geometries while being robust and lightweight. Such devices can be achieved with soft materials and thin-film structures that are able to reshape on demand. However, reshaping at the submillimeter scale remains a challenging task. Herein, shape-controlled microscale devices are demonstrated that integrate electronic sensors and electroactive polymer actuators. The fast and biocompatible actuators are capable of actively reshaping the device into flat or curved geometries. The curvature and position of the devices are monitored with strain or magnetic sensors. The sensor signals are used in a closed feedback loop to control the actuators. The devices are wafer-scale microfabricated resulting in multiple functional units capable of grasping, holding, and releasing biological tissues, as demonstrated with a neuronal bundle.
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    3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications
    (Hoboke, NJ : Wiley, 2020) Karnaushenko, Daniil; Kang, Tong; Bandari, Vineeth K.; Zhu, Feng; Schmidt, Oliver G.
    Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing manufacturing methods. Self‐assembly of initially planar membranes into complex 3D architectures offers a wealth of opportunities to accommodate thin‐film microelectronic functionalities in devices and systems possessing improved performance and higher integration density. Existing work in this field, with a focus on components constructed from 3D self‐assembly, is reviewed, and an outlook on their application potential in tomorrow's microelectronics world is provided.