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DDC: 620 × Subject: Copper ×

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Now showing 1 - 4 of 4
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    Dynamics of serrated flow in a bulk metallic glass
    (New York : American Institute of Physics, 2011) Ren, J.L.; Chen, C.; Wang, G.; Mattern, N.; Eckert, J.
    Under compression loading, bulk metallic glasses (BMGs) irreversibly deform through shear banding manifested as a serrated flow behavior. By using a statistical analysis together with a complementary dynamical analysis of the stress-time curves during serrated flow, we characterize the distinct spatiotemporal dynamical regimes and find that the plastic dynamic behavior of a Cu50Zr45Ti5 BMG changes from chaotic to self-organized critical behavior with increasing strain rate. This plastic dynamics transition with the strain rate is interpreted in the frame of the competence between the neighboring elastic strain field forming and relaxation processes.
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    Laser Embossing of Micro-and Submicrometer Surface Structures in Copper
    (Amsterdam [u.a.] : Elsevier, 2012) Ehrhardt, M.; Lorenz, P.; Frost, F.; Zimmer, K.
    Micro- and submicrometer structures have been transferred from nickel foils into solid copper surfaces by laser microembossing. The developed arrangement for laser microembossing allows a large-area replication using multi- pulse laser scanning scheme, guaranties a low contamination of the embossed surface and enables the utilization of thick workpieces. In the micrometer range the replicated patterns feature a high accuracy regarding the shape. A significant difference between the master and the replication pattern could be observed for the laser embossing of submicrometer patterns. In conclusion, the results show that the proposed laser embossing process is a promising method with a number of applications in microengineering.
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    The Bain library: A Cu-Au buffer template for a continuous variation of lattice parameters in epitaxial films
    (New York : American Institute of Physics, 2014) Kauffmann-Weiss, S.; Hamann, S.; Reichel, L.; Siegel, A.; Alexandrakis, V.; Heller, R.; Schultz, L.; Ludwig, A.; Fähler, S.
    Smallest variations of the lattice parameter result in significant changes in material properties. Whereas in bulk, lattice parameters can only be changed by composition or temperature, coherent epitaxial growth of thin films on single crystals allows adjusting the lattice parameters independently. Up to now only discrete values were accessible by using different buffer or substrate materials. We realize a lateral variation of in-plane lattice parameters using combinatorial film deposition of epitaxial Cu-Au on a 4-in. Si wafer. This template gives the possibility to adjust the in-plane lattice parameter over a wide range from 0.365 nm up to 0.382 nm.
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    Structural evolution in Ti-Cu-Ni metallic glasses during heating
    (New York : American Institute of Physics, 2015) Gargarella, P.; Pauly, S.; Stoica, M.; Vaughan, G.; Afonso, C.R.M.; Kühn, U.; Eckert, J.
    The structural evolution of Ti50Cu43Ni7 and Ti55Cu35Ni10 metallic glasses during heating was investigated by in-situ synchrotron X-ray diffraction. The width of the most intense diffraction maximum of the glassy phase decreases slightly during relaxation below the glass transition temperature. Significant structural changes only occur above the glass transition manifesting in a change in the respective peak positions. At even higher temperatures, nanocrystals of the shape memory B2-Ti(Cu,Ni) phase precipitate, and their small size hampers the occurrence of a martensitic transformation.