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Microstructural Characterization of a Laser Surface Remelted Cu-Based Shape Memory Alloy
Cu-based shape memory alloys (SMAs) present some advantages as higher transformation temperatures, lower costs and are easier to process than traditional Ti-based SMAs but they also show some disadvantages as low ductility and higher tendency for intergranular cracking. Several studies have sought for a way to improve the mechanical properties of these alloys and microstructural refinement has been frequently used. It can be obtained by laser remelting treatments. The aim of the present work was to investigate the influence of the laser surface remelting on the microstructure of a Cu-11.85Al-3.2Ni-3Mn (wt%) SMA. Plates were remelted using three different laser scanning speeds, i.e. 100, 300 and 500 mm/s. The remelted regions showed a T-shape morphology with a mean thickness of 52, 29 and 23 µm and an average grain size of 30, 29 and 23µm for plates remelted using scanning speed of 100, 300 and 500 mm/s, respectively. In the plates remelted with 100 and 300 mm/s some pores were found at the root of the keyhole due to the keyhole instability. We find that the instability of keyholes becomes more pronounced for lower scanning speeds. It was not observed any preferential orientation introduced by the laser treatment.
Laser-induced reactive microplasma for etching of fused silica
The ultra-precise machining (UPM) of surfaces with contact-free, beam-based technologies enables the development of flexible and reliable fabrication methods by non-vacuum processes for future application in advanced industrial fields. Laser machining by laser ablation features limitations for ultra-precise machining due to the depth precision, the surface morphology, and laser-induced defect formation. Contrary to physically-based etching, chemical-based dry and wet processing offer high quality, low damage material removal. In order to take advantage of both principles, a combined laser-plasma process is introduced. Ultra-short laser pulses are used to induce a free-standing microplasma in a CF4 gas atmosphere due to an optical breakdown. CF4 gas, with a pressure of 800–900 mbar, is ionized only near the focal point and reactive species are generated therein. Reactive species of the laser-induced microplasma can interact with the surface atoms of the target material forming volatile products. The release of these products is enhanced by the pulsed, laser-induced plasma resulting in material etching. In the present study, SiO2 surfaces were etched with reactive species of CF4 microplasma generated by their laser-induced break down with 775 nm pulses of an fs-laser (150 fs) at a repetition rate of 1 kHz. The dependency of the depth, the width, and the morphology of the etching pits were analysed systematically against the process parameters used. In particular, a linear increase of the etching depth up to 10 µm was achieved. The etched surface appears smooth without visible cracks, defects, or LIPSS (Laser-induced periodic surface structures). © 2020, The Author(s).
Pattern transfer of sub-micrometre-scaled structures into solid copper by laser embossing
Laser embossing allows the micron and submicron patterning of metal substrates that is of great interest in a wide range of applications. This replication process enables low-cost patterning of metallic materials by non-thermal, high-speed forming which is driven by laser-induced shock waves. In this study the surface topography characteristics as well as the material structure at laser embossing of sub-micrometre gratings into solid copper is presented. The topography of the laser-embossed copper pattern is analysed with atomic force microscopy (AFM) in comparison to the master surface. The height of the embossed structures and the replicated pattern fidelity increases up to a laser fluence of F ∼ 10 J/cm2. For higher laser fluences the height of the embossed structures saturates at 75% of the master pattern height and the shape is adequate to the master. Structural modifications in the copper mono crystals after the laser embossing process were investigated with transmission electron microscopy (TEM) and electron backscatter diffraction (EBSD). Almost no modifications were detected. The residual stress after laser embossing of 32 MPa (F = 30 J/cm2) has only a limited influence on the surface pattern formation.
Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma
Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage. These processes, including reactive ion etching (RIE) and plasma etching (PE), are performed at vacuum conditions and provide high selectivity and vertical side wall etched patterns but create high costs and efforts in maintenance due to the required machinery. In contrast to electrically generated plasmas, laser-induced micro plasmas are controllable sources of reactive species in gases at atmospheric pressure that can be used for dry etching of materials. In the present study, we have demonstrated the laser-induced plasma etching of monocrystalline silicon. A Ti:Sapphire laser has been used for igniting an optically pumped plasma in a CF4/O2 gas mixture near atmospheric pressure. The influence of process parameters, like substrate temperature, O2 concentration, plasma-surface distance, etching duration, pulse energy and crystal orientation on etching rate and surface morphology has been investigated. Typical etching rates of 2–12 µm x min−1 can be achieved by varying mentioned parameters with a decreasing etching rate during the process. Different morphologies can be observed due to the parameters set, smooth as well as rough surfaces or even inverted pyramids. The presented etching method provides an approach for precise machining of silicon surfaces with good surface qualities near atmospheric pressure and sufficiently high material removal rates for ultraprecise surface machining. © 2021 The Author(s)
Laser Embossing of Micro-and Submicrometer Surface Structures in Copper
Micro- and submicrometer structures have been transferred from nickel foils into solid copper surfaces by laser microembossing. The developed arrangement for laser microembossing allows a large-area replication using multi- pulse laser scanning scheme, guaranties a low contamination of the embossed surface and enables the utilization of thick workpieces. In the micrometer range the replicated patterns feature a high accuracy regarding the shape. A significant difference between the master and the replication pattern could be observed for the laser embossing of submicrometer patterns. In conclusion, the results show that the proposed laser embossing process is a promising method with a number of applications in microengineering.
Precision spectroscopy with a frequency-comb-calibrated solar spectrograph
The measurement of the velocity field of the plasma at the solar surface is a standard diagnostic tool in observational solar physics. Detailed information about the energy transport as well as on the stratification of temperature, pressure and magnetic fields in the solar atmosphere are encoded in Doppler shifts and in the precise shape of the spectral lines. The available instruments deliver data of excellent quality and precision. However, absolute wavelength calibration in solar spectroscopy was so far mostly limited to indirect methods and in general suffers from large systematic uncertainties of the order of 100 m/s. During the course of this thesis, a novel wavelength calibration system based on a laser frequency comb was deployed to the solar Vacuum Tower Telescope (VTT), Tenerife, with the goal of enabling highly accurate solar wavelength measurements at the level of 1 m/s on an absolute scale. The frequency comb was developed in a collaboration between the Kiepenheuer-Institute for Solar Physics, Freiburg, Germany and the Max Planck Institute for Quantum Optics, Garching, Germany. The efforts cumulated in the new prototype instrument LARS (Lars is an Absolute Reference Spectrograph) for solar precision spectroscopy which is in preliminary scientific operation since~2013. The instrument is based on the high-resolution echelle spectrograph of the VTT for which feed optics based on single-mode optical fibres were developed for this project. The setup routinely achieves an absolute calibration accuracy of 60 cm/s and a repeatability of 2.5 cm/s. An unprecedented repeatability of only 0.32 cm/s could be demonstrated with a differential calibration scheme. In combination with the high spectral resolving power of the spectrograph of 7x10^5 and virtually absent internal scattered light, LARS provides a spectral purity and fidelity that previously was the domain of Fourier-transform spectrometers only. The instrument therefore provides unique capabilities for precision spectroscopy of the Sun and laboratory light sources. The first scientific observations aimed at measuring the accurate wavelengths of selected solar Fraunhofer lines to characterise the so-called convective blue shift and its centre to limb variation. The convective blueshifts were derived with respect to laboratory wavelengths that were obtained from spectral lamps measured with the same instrument. The measurements agree with previous studies but provide a way higher accuracy. The data is only partially compatible with numerical simulations that were published recently. Further measurements were carried out to provide the absolute wavelengths of telluric O2 lines that are commonly used for wavelength calibration. With an accuracy of 1 m/s, these new measurements are two orders of magnitude better than existing data.