Stress-driven local-solution approach to quasistatic brittle delamination

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Date

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1889

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Journal

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WIAS Preprints

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Berlin : Weierstraß-Institut für Angewandte Analysis und Stochastik

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Abstract

A unilateral contact problem between elastic bodies at small strains glued by a brittle adhesive is addressed in the quasistatic rate-independent setting. The delamination process is modelled as governed by stresses rather than by energies. This results in a specific scaling of an approximating elastic adhesive contact problem, discretised by a semi-implicit scheme and regularized by a BV-type gradient term. An analytical zero-dimensional example motivates the model and a specific local-solution concept. Two-dimensional numerical simulations performed on an engineering benchmark problem of debonding a fiber in an elastic matrix further illustrate the validity of the model, convergence, and algorithmical efficiency even for very rigid adhesives with high elastic moduli.

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