Sachbericht (Teil 1 & Teil 2) des ThinKIsense-Teilvorhabens von NXP Semiconductors Germany GmbH
Verwendungsnachweis ThinKIsense NXP (inhaltlicher Teil)
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Date
Authors
Editor
Advisor
Volume
Issue
Journal
Series Titel
Book Title
Publisher
Hannover : Technische Informationsbibliothek
Supplementary Material
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Abstract
[no abstract available]
Description
Keywords
Keywords GND
Conference
01.07.2022 bis 31.12.2025
Publication Type
Report
Version
publishedVersion
License
Creative Commons Attribution-NonDerivs 3.0 Germany