Strain Engineered Electrically Pumped SiGeSn Microring Lasers on Si

dc.bibliographicCitation.date2023
dc.bibliographicCitation.firstPage217
dc.bibliographicCitation.issue1
dc.bibliographicCitation.journalTitleACS Photonicseng
dc.bibliographicCitation.lastPage224
dc.bibliographicCitation.volume10
dc.contributor.authorMarzban, Bahareh
dc.contributor.authorSeidel, Lukas
dc.contributor.authorLiu, Teren
dc.contributor.authorWu, Kui
dc.contributor.authorKiyek, Vivien
dc.contributor.authorZoellner, Marvin Hartwig
dc.contributor.authorIkonic, Zoran
dc.contributor.authorSchulze, Joerg
dc.contributor.authorGrützmacher, Detlev
dc.contributor.authorCapellini, Giovanni
dc.contributor.authorOehme, Michael
dc.contributor.authorWitzens, Jeremy
dc.contributor.authorBuca, Dan
dc.date.accessioned2023-02-06T10:22:46Z
dc.date.available2023-02-06T10:22:46Z
dc.date.issued2022
dc.description.abstractSiGeSn holds great promise for enabling fully group-IV integrated photonics operating at wavelengths extending in the mid-infrared range. Here, we demonstrate an electrically pumped GeSn microring laser based on SiGeSn/GeSn heterostructures. The ring shape allows for enhanced strain relaxation, leading to enhanced optical properties, and better guiding of the carriers into the optically active region. We have engineered a partial undercut of the ring to further promote strain relaxation while maintaining adequate heat sinking. Lasing is measured up to 90 K, with a 75 K T0. Scaling of the threshold current density as the inverse of the outer circumference is linked to optical losses at the etched surface, limiting device performance. Modeling is consistent with experiments across the range of explored inner and outer radii. These results will guide additional device optimization, aiming at improving electrical injection and using stressors to increase the bandgap directness of the active material.eng
dc.description.versionpublishedVersioneng
dc.identifier.urihttps://oa.tib.eu/renate/handle/123456789/11296
dc.identifier.urihttp://dx.doi.org/10.34657/10332
dc.language.isoeng
dc.publisherWashington, DC : ACS
dc.relation.doihttps://doi.org/10.1021/acsphotonics.2c01508
dc.relation.essn2330-4022
dc.rights.licenseCC BY-NC-ND 4.0 Unported
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0
dc.subject.ddc620
dc.subject.ddc530
dc.subject.othergroup IV laserseng
dc.subject.othermicrodisk laserseng
dc.subject.othersilicon germanium tin (SiGeSn)eng
dc.subject.otherstrain engineeringeng
dc.titleStrain Engineered Electrically Pumped SiGeSn Microring Lasers on Sieng
dc.typeArticleeng
dc.typeTexteng
tib.accessRightsopenAccess
wgl.contributorIHP
wgl.subjectIngenieurwissenschaftenger
wgl.subjectPhysikger
wgl.typeZeitschriftenartikelger
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