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- ItemLaser-Induced front Side Etching: An Easy and Fast Method for Sub-μm Structuring of Dielectrics(Amsterdam [u.a.] : Elsevier, 2012) Lorenz, P.; Ehrhardt, M.; Zimmer, K.Laser-induced front side etching (LIFE) is a method for the nanometer-precision structuring of dielectrics, e.g. fused silica, using thin metallic as well as organic absorber layer attached to the laser-irradiated front side of the sample. As laser source an excimer laser with a wavelength of 248 nm and an pulse duration of 25 ns was used. For sub-μm patterning a phase mask illuminated by the top hat laser beam was projected by a Schwarzschild objective. The LIFE process allows the fabrication of well-defined and smooth surface structures with sub-μm lateral etching regions (Δx < 350 nm) and vertical etching depths from 1 nm to sub-mm.
- ItemLaser structuring of thin layers for flexible electronics by a shock wave-induced delamination process(Amsterdam [u.a.] : Elsevier, 2014) Lorenz, P.; Ehrhardt, M.; Zimmer, K.The defect-free laser-assisted structuring of thin films on flexible substrates is a challenge for laser methods. However, solving this problem exhibits an outstanding potential for a pioneering development of flexible electronics. Thereby, the laser-assisted delamination method has a great application potential. At the delamination process: the localized removal of the layer is induced by a shock wave which is produced by a laser ablation process on the rear side of the substrate. In this study, the thin-film patterning process is investigated for different polymer substrates dependent on the material and laser parameters using a KrF excimer laser. The resultant structures were studied by optical microscopy and white light interferometry (WLI). The delamination process was tested at different samples (indium tin oxide (ITO) on polyethylene terephthalate (PET), epoxy-based negative photoresist (SU8) on polyimide (PI) and indium tin oxide/copper indium gallium selenide/molybdenum (ITO/CIGS/Mo) on PI.
- ItemPattern transfer of sub-micrometre-scaled structures into solid copper by laser embossing(Amsterdam [u.a.] : Elsevier, 2014) Ehrhardt, M.; Lorenz, P.; Lotnyk, A.; Romanus, H.; Thelander, E.; Zimmer, K.Laser embossing allows the micron and submicron patterning of metal substrates that is of great interest in a wide range of applications. This replication process enables low-cost patterning of metallic materials by non-thermal, high-speed forming which is driven by laser-induced shock waves. In this study the surface topography characteristics as well as the material structure at laser embossing of sub-micrometre gratings into solid copper is presented. The topography of the laser-embossed copper pattern is analysed with atomic force microscopy (AFM) in comparison to the master surface. The height of the embossed structures and the replicated pattern fidelity increases up to a laser fluence of F ∼ 10 J/cm2. For higher laser fluences the height of the embossed structures saturates at 75% of the master pattern height and the shape is adequate to the master. Structural modifications in the copper mono crystals after the laser embossing process were investigated with transmission electron microscopy (TEM) and electron backscatter diffraction (EBSD). Almost no modifications were detected. The residual stress after laser embossing of 32 MPa (F = 30 J/cm2) has only a limited influence on the surface pattern formation.
- ItemLaser Patterning of CIGS thin Films with 1550 nm Nanosecond Laser Pulses(Amsterdam [u.a.] : Elsevier, 2016) Ehrhardt, Martin; Lorenz, Pierre; Bayer, Lukas; Zagoranskiy, Igor; Zimmer, KlausThe results of laser scribing experiments of CIGS thin films deposited on Mo-coated stainless steel sheets, using laser pulses with a wavelength of 1550 nm and a pulse duration of 6 ns, are presented in this study. It is shown that a removal of the CIGS from the Mo film is possible without edge melting of the CIGS or damaging of the Mo. The critical parameter for inducing the delamination lift-off process of the CIGS from the Mo was identified to be the scribing speed of the laser. In dependence on the laser parameters two different material removal processes were found. For a low pulse overlap the laser pulse penetrates the CIGS film and is absorbed in the interface between the CIGS and the Mo causing a lift-off process of the CIGS from the Mo back contact. For a high pulse overlap an ablation process starting from the top side of the CIGS film was found. The composition and morphology of the sample material after the laser patterning were analysed by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and micro-Raman spectroscopy.
- ItemIn-process evaluation of electrical properties of CIGS solar cells scribed with laser pulses of different pulse lengths(Amsterdam [u.a.] : Elsevier, 2014) Zimmer, K.; Wang, X.; Lorenz, P.; Bayer, L.; Ehrhardt, M.; Scheit, C.; Braun, A.The optimization of laser scribing for the interconnection of CIGS solar cells is a current focus of laser process development. In addition to the geometry of the laser scribes the impact of the laser patterning to the electrical properties of the solar cells has to be optimized with regards to the scribing process and the laser sources. In-process measurements provide an approach for reliable evaluation of the electrical characteristics. In particular, the parallel resistance Rp that was calculated from the measured I-V curves was measured in dependence on the scribing parameters of a short-pulsed ns laser in comparison to a standard ps laser at a wavelength of 1.06 μm. With low pulse overlap of ∼ 20% a reduction of Rp to 2/3 of the initial value has been achieved for ns laser pulses. In comparison to ps laser slightly more defects were observed at the investigated parameter range.
- ItemNanostructuring of Fused Silica Assisted by Laser-shaped Metal Triangles Using a Nanosecond Laser(Amsterdam [u.a.] : Elsevier, 2016) Lorenz, Pierre; Grüner, Christoph; Ehrhardt, Martin; Bayer, Lukas; Zimmer, KlausSelf-organized processes are of special interest for the laser-induced nanostructuring of surfaces. In this study we combined two self-organized processes: the microsphere lithography and the molten phase transformation for the nanostructuring of dielectrics. A fused silica substrate was covered with periodically ordered polystyrene (PS) spheres and the system was subsequently covered with 30 nm chromium. Afterwards the PS spheres were removed and the bare and resultant periodic Cr triangles were irradiated in two steps using a KrF excimer laser. First step: A low laser fluence treatment results in a melting and shape transformation of the triangles. Second step: A high laser fluence treatment of the pre-treated surface results in a nanostructuring of the dielectric surface (and removal of the metal). The surface topography was studied by scanning electron microscopy. Furthermore, the different steps were simulated and compared with the experimental results.
- ItemShock-wave-induced Thin-film Delamination (SWIFD): A Non-thermal Structuring Method of Functional Layers(Amsterdam [u.a.] : Elsevier, 2016) Lorenz, Pierre; Ehrhardt, Martin; Bayer, Lukas; Zimmer, KlausThe laser structuring of thermally sensitive functional layers is a challenge for laser methods. However, already ultrashort laser pulses can induce thermal modifications. The spatial separation of the laser pulse absorption from the functional layer removal process allows a non-thermal structuring process. Therefore, the rear side of the substrate is irradiated and the following laser ablation process induces a transverse shock wave through the substrate. Finally, the interaction of the shock wave with the substrate/functional layer interface results in a delamination of the functional layer. This shock-wave-induced thin-film delamination (SWIFD) method was tested on a layer system (1.5 μm thick epoxy-based negative photoresist SU 8, 250 nm–1 μm chromium layer) on a 25 μm polyimide flexible substrate where the influence of the systematic variation of the thickness of the metallic intermediate layer on the delamination process was studied. The resultant surface morphology was analyzed by optical microscopy as well as by white light interferometry (WLI).
- ItemLaser Embossing of Micro-and Submicrometer Surface Structures in Copper(Amsterdam [u.a.] : Elsevier, 2012) Ehrhardt, M.; Lorenz, P.; Frost, F.; Zimmer, K.Micro- and submicrometer structures have been transferred from nickel foils into solid copper surfaces by laser microembossing. The developed arrangement for laser microembossing allows a large-area replication using multi- pulse laser scanning scheme, guaranties a low contamination of the embossed surface and enables the utilization of thick workpieces. In the micrometer range the replicated patterns feature a high accuracy regarding the shape. A significant difference between the master and the replication pattern could be observed for the laser embossing of submicrometer patterns. In conclusion, the results show that the proposed laser embossing process is a promising method with a number of applications in microengineering.
- ItemAdvanced Electric Propulsion Diagnostic Tools at IOM(Amsterdam [u.a.] : Elsevier, 2017) Bundesmann, C.; Eichhorn, C.; Scholze, F.; Spemann, D.; Neumann, H.; Scortecci, F.; Leiter, H.J.; Holste, K.; Klar, P.J.; Bulit, A.; Dannenmayer, K.; Amo, J. Gonzalez delRecently, we have set up an Advanced Electric Propulsion Diagnostic (AEPD) platform [1], which allows for the in-situ measurement of a comprehensive set of thruster performance parameters. The platform utilizes a five-axis-movement system for precise positioning of the thruster with respect to the diagnostic heads. In the first setup (AEPD1) an energy-selective mass spectrometer (ESMS) and a miniaturized Faraday probe for ion beam characterization, a telemicroscope and a triangular laser head for measuring the erosion of mechanical parts, and a pyrometer for surface temperature measurements were integrated. The capabilities of the AEPD1 platform were demonstrated with two electric propulsion thrusters, a gridded ion thruster RIT 22 (Airbus Defence & Space, Germany, [13]) and a Hall effect thruster SPT 100D EM1 (EDB Fakel, Russia, [1], [4]), in two different vacuum facilities.
- ItemModelling of a radio frequency plasma bridge neutralizer (RFPBN)(Amsterdam [u.a.] : Elsevier, 2017) Scholze, F.; Eichhorn, C.; Bundesmann, C.; Spemann, D.; Neumann, H.; Bulit, A.; Feili, D.; Gonzalez del Amo, J.A performance model of a radio frequency plasma bridge neutralizer was developed to calculate the electrical parameters and optimize the neutralizer design. Minimization of power losses and gas consumption, and a maximization of the neutralizer lifetime and the reliability of the system are requirements of all electric propulsion concepts and strongly determine their future application. The requirements of the neutralizer depend on mission profiles.