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Title: Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching
Authors: Jia, G.Plentz, J.Gawlik, A.Azar, A.S.Stokkan, G.Syvertsen, M.Carvalho, P.A.Dellith, J.Dellith, A.Andrä, G.Ulyashin, A.
Publishers version: https://doi.org/10.1155/2018/6563730
URI: https://oa.tib.eu/renate/handle/123456789/11671
http://dx.doi.org/10.34657/10704
Issue Date: 2018
Published in: International Journal of Photoenergy 2018 (2018)
Journal: International Journal of Photoenergy
Volume: 2018
Page Start: 1
Page End: 7
Publisher: New York, NY [u.a.] : Hindawi Publ. Corp.
Abstract: In this study, laser-treated polycrystalline Si (pc-Si) wafers, fabricated by wire sawing of hot-pressed ingots sintered from Si powder, have been investigated. As-cut wafers and those with high-quality thin Si layers deposited on top of them by e-beam have been subjected to laser irradiation to clarify typical trends of structural modifications caused by laser treatments. Moreover, possibility to use laser-treated Si powder-based substrates for fabrication of advanced Si structures has been analysed. It is established that (i) Si powder-based wafers with thicknesses 180 μm can be fully (from the front to back side) or partly (subsurface region) remelted by a diode laser and grain sizes in laser-treated regions can be increased; (ii) a high-quality top layer can be fabricated by crystallization of an additional a-Si layer deposited by e-beam evaporation on top of the pc-Si; and (iii) silicon nanowires can be formed by metal-assisted wet chemical etching (MAWCE) of polished Si powder-based wafers and as-cut wafers irradiated with medium laser power, while a surface texturing on the as-cut pc-Si wafers occur, and no nanowires can form in the region subject to a liquid phase crystallization (LPC) caused by high-power laser treatments.
Keywords: High quality; Laser treated; Laser treatment; Low-cost photovoltaics; Polycrystalline-Si; Powder-based; Si layer; Si wafer; Silicon powders; Wire-sawing
Type: article; Text
Publishing status: publishedVersion
DDC: 540
660
License: CC BY 4.0 Unported
Link to license: https://creativecommons.org/licenses/by/4.0/
Appears in Collections:Ingenieurwissenschaften

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Jia, G., J. Plentz, A. Gawlik, A.S. Azar, G. Stokkan, M. Syvertsen, P.A. Carvalho, J. Dellith, A. Dellith, G. Andrä and A. Ulyashin, 2018. Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching. 2018. New York, NY [u.a.] : Hindawi Publ. Corp.
Jia, G., Plentz, J., Gawlik, A., Azar, A. S., Stokkan, G., Syvertsen, M., Carvalho, P. A., Dellith, J., Dellith, A., Andrä, G. and Ulyashin, A. (2018) “Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching.” New York, NY [u.a.] : Hindawi Publ. Corp. doi: https://doi.org/10.1155/2018/6563730.
Jia G, Plentz J, Gawlik A, Azar A S, Stokkan G, Syvertsen M, Carvalho P A, Dellith J, Dellith A, Andrä G, Ulyashin A. Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching. Vol. 2018. New York, NY [u.a.] : Hindawi Publ. Corp.; 2018.
Jia, G., Plentz, J., Gawlik, A., Azar, A. S., Stokkan, G., Syvertsen, M., Carvalho, P. A., Dellith, J., Dellith, A., Andrä, G., & Ulyashin, A. (2018). Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching (Version publishedVersion, Vol. 2018). Version publishedVersion, Vol. 2018. New York, NY [u.a.] : Hindawi Publ. Corp. https://doi.org/https://doi.org/10.1155/2018/6563730
Jia G, Plentz J, Gawlik A, Azar A S, Stokkan G, Syvertsen M, Carvalho P A, Dellith J, Dellith A, Andrä G, Ulyashin A. Silicon Powder-Based Wafers for Low-Cost Photovoltaics: Laser Treatments and Nanowire Etching. 2018;2018. doi:https://doi.org/10.1155/2018/6563730


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